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EM Microelectronic enables easy deployment of smart logistics and location services with a new generation of Bluetooth beacons

EM‘s Swiss quality modules double the range and battery life while lowering the deployment cost.
September 19, 2018

Marin, Switzerland, 17 September 2018 – EM Microelectronic, the ultra-low-power semiconductor company of the Swatch Group and a leading technology provider for connected objects, today announced the release of its next generation family of Bluetooth beacons with longer battery life, longer range, over-the-air customizations and modular certification.

The first beacon of the family, the EMBC22, is an upgrade and replacement of EM’s highly successful EMBC02 BLE beacon. Featuring the latest low-power components, the new beacon is easier to install or deploy thanks to the over-the-air configuration capability. A modular certification enables its use with different housing options, battery sizes … Read More → "EM Microelectronic enables easy deployment of smart logistics and location services with a new generation of Bluetooth beacons"

Renesas and OpenSynergy Adopted by Parrot Faurecia Automotive’s Safe Multi-Display Cockpit

Renesas’ R-Car SoC and OpenSynergy’s Hypervisor Enables Practical Shared Display of Meter Display and IVI Function
September 19, 2018

TOKYO, Japan, Berlin, Germany, September 12, 2018 ―Renesas Electronics Corporation (TSE: 6723), an industry-leading supplier of automotive semiconductor solutions, and OpenSynergy, a market leader in automotive hypervisors, today announced that the Renesas’ system-on-chip (SoC) R-Car H3 and Read More → "Renesas and OpenSynergy Adopted by Parrot Faurecia Automotive’s Safe Multi-Display Cockpit"

eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design

Validated 7nm platform includes 56G SerDes, HBM2 PHY, AI mega/giga cells, including convolution engine and accelerator builder software
September 18, 2018

SAN JOSE, Calif. — September 18, 2018 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the availability of its 7nm neuASIC™ IP platform for customer AI ASIC designs. AI ASICs are typically challenged by changing AI algorithms that are difficult for a static ASIC design to adapt to. Through customized, targeted IP offered in 7nm FinFET technology and a modular design methodology, the neuASIC platform removes the restrictions imposed by changing AI algorithms. The platform includes a library of AI-targeted functions that can be quickly combined and configured to create … Read More → "eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design"

Bidirectional Buffer from Diodes Incorporated Provides Automatic Connection and Isolation for Serial Busses in Hot-Swap Environment

September 18, 2018

Plano, Texas – 13 September, 2018 Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, today announced the PI6ULS5V9511A I2C/SMBus buffer, ( https://www.diodes.com/part/PI6ULS5V9511A ) which enables hot-swappable line-cards … Read More → "Bidirectional Buffer from Diodes Incorporated Provides Automatic Connection and Isolation for Serial Busses in Hot-Swap Environment"

ACEINNA Launches the First Open Source IMU Development Kit for Drones, Robots and AGVs

ACEINNA Integrated Hardware and Software Can Slash Development Time and Costs by Up to 80%
September 18, 2018

Andover, Massachusetts – September 13, 2018

ACEINNA announces OpenIMUTM – a first of its kind professionally supported, open-source GPS/GNSS-aided inertial navigation software stack for low-cost precise navigation applications.

Whether you are developing autonomously guided vehicles for industrial applications, autonomous cars, factory or industrial robots, drones, ROVs, any kind of smart machine which needs to move – fast or slow, on land, in the air, or in water, integrating an IMU (Inertial Measurement Unit) based sensor network will greatly improve its navigation and self-location capabilities.

“Our breakthrough … Read More → "ACEINNA Launches the First Open Source IMU Development Kit for Drones, Robots and AGVs"

Reflex Photonics launches a new line of 28 Gbps per lane, radiation-resistant optical modules for space applications.

September 17, 2018

Kirkland (Montréal), September 12, 2018: Reflex is proud to announce the launch of a new line of radiation-resistant optical modules offering up to 28 Gbps per lane.

This line of optical modules consists of the SpaceABLE28™ transceiver and the SpaceCONEX28™ board-edge, active optical blind mate interconnect.

Radiation-resistant devices

Reflex Photonics’ radiation-resistant or “Space-grade” transceivers are engineered … Read More → "Reflex Photonics launches a new line of 28 Gbps per lane, radiation-resistant optical modules for space applications."

MaxLinear and NewVasTek Announce Breakthrough Wireless Gigabit Data and Power Solution

September 17, 2018
  • Joint solution delivers multi-gigabit data throughput and up to 60 watts of wireless power through solid walls and low-E glass windows

    Solution targeted at emerging 5G fixed wireless broadband access applications

    CARLSBAD, Calif. – Sept. 14, 2018 – MaxLinear, Inc. (NYSE:MXL), a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for wireless and wired infrastructure, industrial, the connected home and multimarket applications, and NewVasTek, a leading provider of customized solutions for wireless power transfer based in Taiwan, today announced a joint reference design that combines MaxLinear’s AirPHY(tm) multi-gigabit modem technology with NewVasTek’s customized … Read More → "MaxLinear and NewVasTek Announce Breakthrough Wireless Gigabit Data and Power Solution"

Molex high-density, Ultra-Fit Power Connectors occupy 50% less PCB space, provide up to 14A – now at TTI

Eliminate same circuit size cross-mating; reduce terminal backout; low mating force; 3.50mm pitch
September 17, 2018

September 2018 – Now available at TTI, Inc., a world leading specialist distributor of electronic components, Molex Ultra-Fit Power Connectors have a streamlined design that enables smaller, more efficient packaging than similar power interconnects, yet still provide similar current density.  Ultra-Fit Power Connectors provide up to 14A, but take up less than half the PCB footprint of comparable devices, enabling electronics designers to solve challenges across a very wide spectrum of products.

Features of Molex Ultra-Fit Power Connectors include multiple mechanically-keyed colour coded options which enables same-circuit, multiple connector use with virtually no chance of … Read More → "Molex high-density, Ultra-Fit Power Connectors occupy 50% less PCB space, provide up to 14A – now at TTI"

150°C Conductive Polymer Hybrid Capacitor portfolio in THT format from Panasonic Industry Europe suits Automotive uses

ZF Series enables mission-critical applications; first Hybrid Capacitors in through-hole format
September 17, 2018

Munich, September 2018: Panasonic Industry Europe is expanding its conductive polymer hybrid aluminum electrolytic capacitor range with its new ZF series products, rated at 1,000 hours at 150°C, enabling devices to support cutting-edge power train and engine-mounted applications in the automotive sector. Besides the high temperature rating, ZF Series hybrid capacitors are the first available in Through Hole Technology.

Hybrid capacitors are one of the most promising solutions for high-endurance and high-performance application that also require miniaturization. The conductive polymer hybrid enables stable and very low ESR across the full temperature range of -55°C … Read More → "150°C Conductive Polymer Hybrid Capacitor portfolio in THT format from Panasonic Industry Europe suits Automotive uses"

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