industry news
Subscribe Now

OMNIVISION Announces the First 200MP Resolution Image Sensor with the World’s Smallest 0.61-micron Pixel Size for High End Smartphones

Announced at CES 2022, OMNIVISION revolutionizes smartphone cameras with the OVB0B, a 0.61 µm pixel 200MP resolution image sensor featuring 16-cell CFA for dramatically better preview and video quality

LAS VEGAS — January 5, 2022 — OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog and touch & display technology, today announced at CES 2022 the OVB0B―the world’s smallest 200MP image sensor with pixel size at just 0.61 µm for smartphone cameras. The unique 16-cell binning of the OVB0B delivers premium video and preview quality in 12.5MP mode, especially in low light. The OVB0B is the first 200MP to offer 100% quad phase detection (QPD) technology for excellent fast autofocus performance.

“Consumers want high resolution captures and high quality preview and video. As the image sensor technology leader, we have applied our PureCel®Plus‑S stacked die technology to dramatically push mobile main cameras to a new level,” said Arun Jayaseelan, staff marketing manager at OMNIVISION. “With the new OVB0B, we now offer the industry’s highest resolution in a small package for high end smart phones along with the best low-light performance in its class.”

The OVB0B features the industry’s first 16-cell binning capability for 4K2K video with 16 times the sensitivity. In low light environments it achieves 12.5MP performance with 2.44 µm-equivalent pixel size using near pixel 4×4 binning. An on-chip remosaic enables 50MP at 24 frames per second (fps) and 8k video at 30 fps with 1.22 µm-equivalent performance. The OVB0B can also output 12.5MP at 30 fps with 3‑exposure staggered HDR timing.

“The introduction of 200MP image sensor products for smartphone cameras promises to capture stunning details within images, meeting the needs of smartphone vendors who are aggressively looking to differentiate their devices with enhanced cameras that feature high-resolution image sensors. We estimate more than 40 million image sensors with 100MP+ resolution are expected to be shipped to smartphone vendors in 2022,” says Jeffrey Mathews, senior analyst at Strategy Analytics.

The OVB0B supports CPHY, DPHY and dual DOVDD (1.8V and 1.2V). Samples of the OVB0B are available now. Contact your OMNIVISION sales representative for more information: www.ovt.com/contact-sales.

For more information, contact your OMNIVISION sales representative: www.ovt.com/contact-sales or please schedule a virtual meeting during CES 2022: https://www.ovt.com/news-events/events/ces-2022.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Littelfuse Protection IC (eFuse)
If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design.
May 8, 2023
41,791 views