industry news
Subscribe Now

Nicomatic opens new testing laboratory, offering materials test services for customer products

New fully staffed, highly-specified materials test lab now offers a range of test & qualification services to customers with demanding applications

May 2023, Bon-end-Chablais, France: As part of its design and development process for rugged, harsh environment and high reliability (hi-rel) applications, leading manufacturer of high-performance interconnect systems, Nicomatic subjects its products to stringent environmental, mechanical and electrical tests – ensuring they meet complex industry standards and specifications. Now, the company has opened a materials testing laboratory offering these test and qualification services to customers with demanding applications.

Dedicated Nicomatic test engineers work closely with customer design and development teams, applying their expertise to complex materials test and qualification of customer projects. Nicomatic’s test lab is quality management system certified to ISO 9001 & AS9100, with decades of experience in meeting industry standards and specifications across defence, aeronautics and space applications, including MIL-DTL-55302, MIL-DTL-83513 and ESCC3401.

Almost a dozen test instruments and machines perform more than 30 tests to ensure customer products, devices and systems are comprehensively performance tested, including:

  • Signal integrity: a Rohde & Schwarz vector network analyzer performs characterization of signals across time and frequency domains, as well as for standard communications protocols (including Ethernet, USB, SATA and HDMI).
  • Environmental: using a Labworks vibration test bench, tests can be carried out for vibration, magnetic permeability, temperature cycling, with damp or dry heat or cold, thermal shock and humidity-controlled salt spray.
  • Mechanical: using a vertical test bench and an Antilog Atlas II CC automated materials testing machine, tests can be carried out for tensile and mechanical strength, separation, retention and mating/unmating force, as well as cable crimp tensile strength.
  • Electrical: a Sefelec dielectric meter can be used to perform both hipot and insulation test, determining dielectric withstanding or breakdown voltage, at specific altitudes between sea level (1 bar) and 100,000 feet (10 mbar), as well as insulation resistance test from sea level to high altitude.
  • Chemical: tests include fluid resistance, marking and silicon elasticity/expansion.

“This new test laboratory fulfils several important roles for Nicomatic,” explained Jorris Martel, Test Engineer at Nicomatic. “The first one is to qualify all our interconnect products to the relevant industry standards and specifications. Through this first process, we can provide all the data and information that customers require in term of performance.

“But arguably our most critical assignment,” Martel continued, “is to assist customers during their implementation of Nicomatic products in their application. Our goal is to offer their design engineers the advice and answers they need to assure the best customer experience. We are not a simple test laboratory: our real value is to provide specialist interconnect advice and expertise where others cannot.”

Customers wanting to verify their products and solutions can now work with the test engineers and subject matter experts that staff Nicomatic’s test laboratory to characterize, qualify and thoroughly test the connector components and sub-assemblies – ensuring they meet the industry standards and specifications needed for demanding hi-rel applications. For more info, contact p.mcdavitt@nicomatic.com, visit www.nicomatic.com/contact or call +44 (0) 1183 801 033.

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 26, 2023
5G coverage from space has the potential to make connectivity to the Internet truly ubiquitous for a broad range of use cases....
Sep 26, 2023
Explore the LPDDR5X specification and learn how to leverage speed and efficiency improvements over LPDDR5 for ADAS, smartphones, AI accelerators, and beyond.The post How LPDDR5X Delivers the Speed Your Designs Need appeared first on Chip Design....
Sep 26, 2023
The eighth edition of the Women in CFD series features Mary Alarcon Herrera , a product engineer for the Cadence Computational Fluid Dynamics (CFD) team. Mary's unwavering passion and dedication toward a career in CFD has been instrumental in her success and has led her ...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit https://intel.ly/45B65Ij

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

Miniaturization Impact on Automotive Products
Sponsored by Mouser Electronics and Molex
In this episode of Chalk Talk, Amelia Dalton and Kirk Ulery from Molex explore the role that miniaturization plays in automotive design innovation. They examine the transformational trends that are leading to smaller and smaller components in automotive designs and how the right connector can make all the difference in your next automotive design.
Sep 25, 2023
44 views