industry news
Subscribe Now

Nicomatic exhibits space-proven hi-rel connectors at Space-Comm, launches new Flat Flexible Cables for Space

Highly-modular DMM, CMM and EMM connectors as used on space programmes; new FFCs for Space showcased for first time in Europe

September 2022, Bon-en-Chablais, France: Nicomatic, the leading manufacturer of high-performance interconnect systems, is showcasing its high-reliability, space-proven modular interconnects at Space-Comm, the UK’s largest exhibition focused on the commercial future of space for business, defence and aerospace.  Also being shown for the first time in Europe are Nicomatic’s Flat Flexible Cables (FFCs) for Space – dense, lightweight flexible cables that ensure signal and power connection in all types of space applications.

Harsh-environment electronic space systems require highly-specialised interconnect components to enable peak technical performance and secure data transmission in the extreme conditions of space.  Nicomatic’s DMM, CMM and EMM series connectors have all been specified in recent space applications, including the ExoMars programme (CMM Series in the TGO space module); Jade Rabbit Chinese Space Programme (custom connector in the Jade Rabbit rover) and multiple other international space and satellite programmes.

Dense and lightweight and designed to be folded or coiled, the new FFCs for Space not only deliver significant weight and space savings, but also overcome space-industry challenges by integrating cables into complete interconnect solutions.  Manufactured from NASA-grade materials, FFCs for Space create strong board-to-board connections on PCBs and display boards in electronic equipment, systems and sub-assemblies, linking data and power points in tight areas.  These lighter, more flexible interconnects ensure robust, reliable signal and power connection in satellites, exploration rovers, solar arrays, research orbiters, HD cameras and controllers, radar and satcomm systems, communication units, optical sensors and simulators.

DMM Series 2mm pitch low-profile metal connectors comply with MIL-DTL-83513G performances and enable a far wider choice of arrangements compared to other mil-spec connectors such as Micro-D or Sub-D.  Highly modular, contacts can be signal (LF), power (HP) and Coax (HF), up to ten million arrangements for board-to-board, board-to-wire, wire-to-wire or panel mount.

CMM Series 2mm pitch MIL-DTL-55302F connectors also offer signal, power and coax with more than 20 million arrangements possible. They save up to 60% space and up to 50% weight compared with other connectors offering the same functionality.  Shock-and-vibration-resistant, oxygen-free, radiation-resistant and able to withstand temperature cycling between –6-0degC and +250degC, CMM connectors are proven to withstand the rigours of multiple space applications.

On a 1.27mm pitch, the MIL-DTL-83513 conformant EMM Series is more than 40% smaller than its parent CMM, or 20% compared to Micro-D. Key features include reversed contacts, integrated 90-degree back protection and interchangeable hardware. Again, extreme modularity is offered, with 04 to 60 signal contacts for board-to-board (thanks to secure wiping length) and board-to-wire configurations.

Highly experienced in solving the complex interconnect problems found in space projects, including creating custom solutions, Nicomatic engineers are available on the stand at Space-Comm and throughout Nicomatic’s global network of offices.

Leave a Reply

featured blogs
Dec 8, 2023
Read the technical brief to learn about Mixed-Order Mesh Curving using Cadence Fidelity Pointwise. When performing numerical simulations on complex systems, discretization schemes are necessary for the governing equations and geometry. In computational fluid dynamics (CFD) si...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Automotive/Industrial PSoC™ High Voltage (HV) Overview
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Marcelo Williams Silva from Infineon explore the multitude of benefits of Infineon’s PSoC 4 microcontroller family. They examine how the high precision analog blocks, high voltage subsystem, and integrated communication interfaces of these solutions can make a big difference when it comes to the footprint size, bill of materials and functional safety of your next automotive design.
Sep 12, 2023