industry news
Subscribe Now

Nexperia’s new bipolar junction transistors in DPAK-package deliver high reliability performance for automotive and industrial applications

MJD series now available covering 2 – 8 A and 45 – 100 V and strengthening Nexperia’s power portfolio

Nijmegen, July 29 2021: Nexperia, the expert in essential semiconductors, today announced nine new power bipolar transistors, extending its portfolio of products in the thermally and electrically advantageous DPAK package to cover applications from 2 A to 8 A and from 45 V up to 100 V. The new MJD series parts are pin-to-pin compatible with other MJD devices in DPAK-package, and they also offer significant reliability benefits.

Available as automotive-qualified AEC-Q101 devices and industrial grade parts, the new MJD series bipolar transistors are rated at 2 A 50 V (MJD2873/-Q), 3 A 100 V (MJD31CH-Q), 4 A 45 V (MJD148/-Q), and 6 A 100 V (MJD41C /-Q and MJD42C /-Q). The MJD31CH-Q is designed as high gain version. All parts offer class-leading DPAK package reliability performance, with an industry-standard footprint. The bipolar transistors suit a wide range of applications such as LED automotive lighting; backlight dimming in LCD displays; linear voltage regulators; relay replacement; motor drives and MOSFET drivers.

Pedram Zoroofchi, Product Manager at Nexperia comments: “Nexperia is known as a high volume, high quality supplier for a broad customer base. By widening our MJD series of power bipolar transistors we provide designers with additional voltage-current options in a robust DPAK package. Therefore, our customers can benefit from the renowned quality and performance offered by Nexperia as a high-performance supplier.”

For more information, including product specs and datasheets, visit:  www.nexperia.com/products/MJD

You can also view this new technology in action at Nexperia’s Power Live Event 21 – 23 September https://www.nexperia.com/power-live

Leave a Reply

featured blogs
Sep 20, 2021
The Cadence Scholarship Program is the flagship CSR program of Cadence India, introduced five years ago. Many meritorious students from under-served sections of society drop out of the education... [[ Click on the title to access the full blog on the Cadence Community site. ...
Sep 18, 2021
Projects with a steampunk look-and-feel incorporate retro-futuristic technology and aesthetics inspired by 19th-century industrial steam-powered machinery....
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Maxim Integrated is now part of Analog Devices

Sponsored by Maxim Integrated (now part of Analog Devices)

What if we didn’t wait around for the amazing inventions of tomorrow – and got busy creating them today?

See What If: analog.com/Maxim

featured paper

What is a smart DAC?

Sponsored by Texas Instruments

See how to add simple logic and programmability to analog circuits, without writing, maintaining and qualifying software. These devices have built-in non-volatile memory and are factory programmable. They also include programmable state machines, PWM generators and custom waveform generators – all in a single device. This means that adding simple intelligence to your analog circuits no longer requires a microcontroller.

Click to read more

featured chalk talk

Build, Deploy and Manage Your FPGA-based IoT Edge Applications

Sponsored by Mouser Electronics and Intel

Designing cloud-connected applications with FPGAs can be a daunting engineering challenge. But, new platforms promise to simplify the process and make cloud-connected IoT design easier than ever. In this episode of Chalk Talk, Amelia Dalton chats with Tak Ikushima of Intel about how a collaboration between Microsoft and Intel is pushing innovation forward with a new FPGA Cloud Connectivity Kit.

Click here for more information about Terasic Technologies FPGA Cloud Connectivity Kit