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Nexperia further expands its offering of Clip-bonded FlatPower packaged diodes with new automotive CFP2-HP devices

Driving the transition in product packaging by investing in capacity and portfolio

Nijmegen, May 16, 2022: Nexperia, the expert in essential semiconductors, today announced the release of 14 rectifiers for power applications in its new CFP2-HP (Clip-Bonded FlatPower) packaging. Available in standard and AECQ-101 versions, these include 45 V, 60 V and 100 V Trench Schottky rectifiers (with 1 and 2 A options) including the PMEG100T20ELXD-Q, a 100 V, 2 A Trench Schottky barrier rectifier. For applications requiring hyperfast recovery Nexperia has also added the 200 V, 1 A PNE20010EXD-Q rectifier to the portfolio.

In modern car architectures the number of electronic control units (ECU) is gradually being reduced in favor of fewer high performing, feature-rich ECUs responsible for front axle, rear axle and body control. As a result, the component density of these units is dramatically increasing and in order to realize these higher density designs, manufacturers increasingly rely on modern multilayer PCBs. The vertical thermal design on these multilayer PCBs enables designers to save up to 75% of board space with CFP2-HP compared to using a device in a SMA package, while still maintaining the same level of electrical performance. This rugged package design enables longer operating times and better board level reliability, while the new lead shape improves automatic optical inspection (AOI).

“With the switch to smaller packages like CFP being now well underway, Nexperia is aiming to be the driving force that further accelerates this transition” according to Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. “Nexperia has invested heavily to expand its capacity to serve the growing demand for CFP-packaged products stays well ahead of market projections for the next three years. These diodes are the latest additions to over 240 CFP-packaged products which Nexperia currently offers.”

Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky, silicon germanium and recovery rectifiers but can also be extended to bipolar transistors. It offers significant product diversity, covering single/dual configuration and currents between 1-20 A, simplifying board design.

For more information, including product specs and datasheets, please visit www.nexperia.com/cfp

About Nexperia
Nexperia is a leading expert in the high-volume production of essential semiconductors, components that are required by every electronic design in the world. The company’s extensive portfolio includes diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs and analog & logic ICs. Headquartered in Nijmegen, the Netherlands, Nexperia annually ships more than 100 billion products, meeting the stringent standards set by the automotive industry. These products are recognized as benchmarks in efficiency – in process, size, power, and performance — with industry-leading small packages that save valuable energy and space.

With decades of experience in supplying to the world’s leading companies, Nexperia has over 14,000 employees across Asia, Europe, and the US. Nexperia, a subsidiary of Wingtech Technology Co., Ltd. (600745.SS), has an extensive IP portfolio and is certified to IATF 16949, ISO 9001, ISO 14001, and ISO 45001.

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