industry news
Subscribe Now

New toolchain and software package from STMicroelectronics ease development of edge processing with intelligent inertial sensors

On display at Sensor+Test 2023 in Nuremberg, Germany, May 9-11

Geneva, May 3, 2023 – STMicroelectronics has released a toolchain and accompanying software package for programming the intelligent sensor processing unit (ISPU) embedded in the latest-generation intelligent MEMS IMUs, ISM330IS and LSM6DSO16IS. The toolchain and software help employ the ISPU to handle motion-related workloads such as activity recognition and anomaly detection directly in the sensor. This permits reducing system power and latency, offloading the local microcontroller, and uniquely specializing the behavior of the sensor to the application.

Using the ISPU toolchain, developers can program the sensor’s intelligent processing unit using the familiar and widespread C programming language. They can choose to work from a command line interface (CLI) or an Eclipse-based environment like STM32CubeIDE, and to use a graphical user interface (GUI) such as AlgoBuilder and Unicleo.

The X-CUBE-ISPU software package contains templates and example projects as well as ready-to-use libraries that help developers quickly understand how to use and program the sensors’ ISPU and can be used as a starting point to implement custom algorithms. Pre-built files are also available, which lets users load the X-CUBE-ISPU examples directly into the sensor using one of the GUIs, with no coding required. In addition, a GitHub repository is available providing more examples, tutorials, and other development resources.

Using these resources helps make short work of developing applications such as personal electronics including wearable devices for activity recognition and health monitoring, as well as industrial devices such as asset trackers, equipment-condition monitors, robots, and machine controllers.

ST’s ISM330IS and LSM6DSO16IS inertial modules contain an always-on 3D accelerometer and 3D gyroscope with the embedded ISPU. They feature low power consumption, drawing as little as 0.46mA in low-power mode, and low noise at 70μg/√Hz in high-performance mode. Sensor hub functionality allows them to collect data from up to four additional external sensors. An embedded temperature sensor is also included, and each device is housed in a compact 2.5mm x 3mm x 0.83mm plastic land grid array (LGA) package.

SPM Instrument (https://www.spminstrument.com/), a Strängnäs, Sweden, based innovator in condition monitoring and process optimization, relied on ST’s ISPU toolchain and the X-CUBE-ISPU to tailor, in a short time, the ISPU behavior in their new products for vibration-severity analysis that contain the ISM330IS sensor.

SPM’s sensing solution is ideal for remote condition monitoring of standard production equipment such as pumps and fans, as well as inaccessible machines and equipment placed in hostile or risky environments. The ISM330IS enabled designers to meet a tight power budget, also overcoming the limited processing capabilities available in the local microcontroller.

SPM also features in ST’s intelligent-sensing webinar, which is available at the registration page: Webinar: In-sensor monitoring with intelligent MEMS sensors – STMicroelectronics.

The ISPU-toolchain, X-CUBE-ISPU and GitHub model zoo are ready now to download, free of charge, at st.com. The ISM330IS and LSM6DSO16IS intelligent MEMS sensors are in production now and available — with free samples at ST eSTore — or at distributors, priced from $3.92 for the LSM6DSO16IS and $3.97 for the ISM330IS.

Please visit www.st.com/ispu for more information.

Leave a Reply

featured blogs
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Medical Grade Power
Sponsored by Mouser Electronics and RECOM
In this episode of Chalk Talk, Amelia Dalton and Louis Bouche from RECOM explore the various design requirements for medical grade power supplies. They also examine the role that isolation and leakage current play in this arena and the solutions that RECOM offers in terms of medical grade power supplies.
Nov 9, 2023
21,598 views