industry news
Subscribe Now

New toolchain and software package from STMicroelectronics ease development of edge processing with intelligent inertial sensors

On display at Sensor+Test 2023 in Nuremberg, Germany, May 9-11

Geneva, May 3, 2023 – STMicroelectronics has released a toolchain and accompanying software package for programming the intelligent sensor processing unit (ISPU) embedded in the latest-generation intelligent MEMS IMUs, ISM330IS and LSM6DSO16IS. The toolchain and software help employ the ISPU to handle motion-related workloads such as activity recognition and anomaly detection directly in the sensor. This permits reducing system power and latency, offloading the local microcontroller, and uniquely specializing the behavior of the sensor to the application.

Using the ISPU toolchain, developers can program the sensor’s intelligent processing unit using the familiar and widespread C programming language. They can choose to work from a command line interface (CLI) or an Eclipse-based environment like STM32CubeIDE, and to use a graphical user interface (GUI) such as AlgoBuilder and Unicleo.

The X-CUBE-ISPU software package contains templates and example projects as well as ready-to-use libraries that help developers quickly understand how to use and program the sensors’ ISPU and can be used as a starting point to implement custom algorithms. Pre-built files are also available, which lets users load the X-CUBE-ISPU examples directly into the sensor using one of the GUIs, with no coding required. In addition, a GitHub repository is available providing more examples, tutorials, and other development resources.

Using these resources helps make short work of developing applications such as personal electronics including wearable devices for activity recognition and health monitoring, as well as industrial devices such as asset trackers, equipment-condition monitors, robots, and machine controllers.

ST’s ISM330IS and LSM6DSO16IS inertial modules contain an always-on 3D accelerometer and 3D gyroscope with the embedded ISPU. They feature low power consumption, drawing as little as 0.46mA in low-power mode, and low noise at 70μg/√Hz in high-performance mode. Sensor hub functionality allows them to collect data from up to four additional external sensors. An embedded temperature sensor is also included, and each device is housed in a compact 2.5mm x 3mm x 0.83mm plastic land grid array (LGA) package.

SPM Instrument (https://www.spminstrument.com/), a Strängnäs, Sweden, based innovator in condition monitoring and process optimization, relied on ST’s ISPU toolchain and the X-CUBE-ISPU to tailor, in a short time, the ISPU behavior in their new products for vibration-severity analysis that contain the ISM330IS sensor.

SPM’s sensing solution is ideal for remote condition monitoring of standard production equipment such as pumps and fans, as well as inaccessible machines and equipment placed in hostile or risky environments. The ISM330IS enabled designers to meet a tight power budget, also overcoming the limited processing capabilities available in the local microcontroller.

SPM also features in ST’s intelligent-sensing webinar, which is available at the registration page: Webinar: In-sensor monitoring with intelligent MEMS sensors – STMicroelectronics.

The ISPU-toolchain, X-CUBE-ISPU and GitHub model zoo are ready now to download, free of charge, at st.com. The ISM330IS and LSM6DSO16IS intelligent MEMS sensors are in production now and available — with free samples at ST eSTore — or at distributors, priced from $3.92 for the LSM6DSO16IS and $3.97 for the ISM330IS.

Please visit www.st.com/ispu for more information.

Leave a Reply

featured blogs
Jun 1, 2023
In honor of Pride Month, members of our Synopsys PRIDE employee resource group (ERG) share thoughtful lessons on becoming an LGBTQIA+ ally and more. The post Pride Month 2023: Thoughtful Lessons from the Synopsys PRIDE ERG appeared first on New Horizons for Chip Design....
Jun 1, 2023
It's been 40 years since Jim Solomon, Richard Newton and Alberto Sangiovanni-Vincentelli co-founded SDA Systems, a physical IC design tools company that became Cadence. Most want to measure this year as the 35 th birthday of Cadence, marked by the merger of SDA Systems and EC...
May 8, 2023
If you are planning on traveling to Turkey in the not-so-distant future, then I have a favor to ask....

featured video

Automatically Generate, Budget and Optimize UPF with Synopsys Verdi UPF Architect

Sponsored by Synopsys

Learn to translate a high-level power intent from CSV to a consumable UPF across a typical ASIC design flow using Verdi UPF Architect. Power Architect can focus on the efficiency of the Power Intent instead of worrying about Syntax & UPF Semantics.

Learn more about Synopsys’ Energy-Efficient SoCs Solutions

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
1,444 views