industry news
Subscribe Now

New MOTIX™ family of full-bridge ICs for smart brushed DC motor applications enables comfort and convenience in vehicles

Munich, Germany – 15 January 2025 – With the automotive industry continuing to evolve, features that were once considered premium are now becoming standard. As a result, smart low-voltage motors will play an increasingly important role in shaping tomorrow’s user experience in the vehicle. Automotive manufacturers are looking for more reliable, energy-efficient and cost-effective semiconductor solutions that can work effectively even under the given harsh conditions. To address this demand, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is now expanding its portfolio with the MOTIX™ Bridge BTM90xx family, a product family of full-bridge/ H-bridge integrated circuits (ICs), specifically designed for brushed DC motor applications. The new BTM90xx full-bridge ICs complement the MOTIX low-voltage motor control IC portfolio spanning from driver ICs to highly integrated system-on-chip (SoC) solutions. BTM90xx devices are not limited to but in particular optimized for automotive applications such as door, mirror, seat, body and zone control modules. Accompanying safety documentation is available to allow use also in safety relevant applications.

The BTM90xx family is characterized by a high functionality to enable intelligent and tiny motor control solutions. The devices, with a supply voltage range for normal operation of 7 V to 18 V (extended 4.5 V to 40 V) offer extensive protection and diagnostic functions such as overtemperature, undervoltage, overcurrent, cross-current or short-circuit detection. Currents are measured for both the high-side and low-side switches and the devices are suitable for automotive applications with a current limit of at least 10 A (BTM901x) or 20 A (BTM902x). PWM operation is possible for frequencies up to 20 kHz. The BTM9011EP and BTM9021EP are SPI variants and support pin-saving daisy chain function to help reduce overall system costs. BTM9021 in addition features an integrated watchdog. The BTM90xx’s tiny TSDSO-14 (4.9 x 6.0 mm) package reduces the overall PCB board space required and features a large exposed pad that simultaneously improves the device’s thermal performance.

To simplify the evaluation and design-in process for MOTIX BTM90xx, Infineon also provides a comprehensive support package, including technical product documentation, simulation models, a tool for calculating power dissipation, evaluation boards and Arduino example code. In addition, software (MOTIX BTM90xx Device Driver) and the MOTIX Full Bridge IC Configuration Wizard are available for free at the  Infineon Developer Center (IDC).

Availability

The MOTIX devices BTM9010EP, BTM9011EP, BTM9020EP and BTM9021EP can be ordered now. Further information is available at www.infineon.com/BTM90xx.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 58,060 employees worldwide (end of September 2024) and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Further information is available at www.infineon.com

Leave a Reply

featured blogs
Feb 24, 2026
How a perfectly good Bosch HVAC system was undermined by preventable mistakes, and a thermostat interface that defies logic....

featured video

Cadence Chiplets Solutions | Helping you realize your chiplet ambitions

Sponsored by Cadence Design Systems

In this webinar, David Glasco, VP of Compute Solutions at Cadence, discusses how Cadence enables customers to transition from traditional monolithic SoC architectures to modular, scalable chiplet-based solutions, essential for meeting the growing demands of physical AI applications and high-performance computing.

Read eBook: Helping You Realize Your Chiplet Ambitions

featured chalk talk

Global Coverage With NTN
In this episode of Chalk Talk, Paul Fadlovich from TE Connectivity and Martin Lesund from Nordic Semiconductor and Amelia Dalton explore the what, why and how of NTN technology. They also explore the role that antennas play in satellite communication systems, and how Nordic Semiconductor’s nRF9151 System-in-Package and TE Connectivity’s broad range of antenna solutions can jump start your next global IoT design.
Feb 19, 2026
9,116 views