industry news
Subscribe Now

Molex Sets New Standard in Space-Saving Connections with Commercial Availability of Ground-Breaking Quad-Row Board-to-Board Connectors

  • World’s smallest board-to-board connectors ideally suited for space-constrained smartphones, smartwatches, wearables, AR/VR devices and more
  • Staggered-circuit layout offers 30% space savings over conventional connector designs
  • Robust features deliver increased strength for more reliable performance
  • Over 50 million units shipped since 2020 to support major smartwatch manufacturer

LISLE, IL – June 22, 2022 – Molex, a global electronics leader and connectivity innovator, today announced the commercial availability of the Molex Quad-Row Board-to-Board Connectors, featuring the industry’s first staggered-circuit layout for 30% space savings over conventional connector designs. These patent-pending connectors offer product developers and device manufacturers greater freedom and flexibility to support compact form factors, including smartphones, smartwatches, wearables, game consoles and Augmented Reality/Virtual Reality (AR/VR) devices.

“Molex continually drives connectivity innovations in support of increasingly smaller yet more powerful devices,” said Justin Kerr, vice president and general manager, Micro Solutions Business Unit, Molex. “With the high-density, Quad-Row Board-to-Board Connectors, our customers now can squeeze more features, sensors and functionality into increasingly tight spaces without compromising device performance. As a result, Molex is setting a new connectivity standard for space optimization.”

First-Ever Staggered Circuit Layout Delivers Unprecedented Space Savings 

Molex’s long-standing collaboration with product developers from a major smartwatch manufacturer propelled the initial design of the Quad-Row Board-to-Board Connectors. Molex engineers also worked with experts from a global leader in the design, development and manufacturing of Flexible Printed Circuits (FPCs). Together, the engineering teams validated the first-ever, staggered circuit layout, which positions pins across four rows at a signal contact pitch of 0.175mm. The result delivers unprecedented space savings while enabling high-density circuit connectivity.

The Quad-Row Board-to-Board Connectors adhere to the 3.0A current rating, meeting customer requirements for high power in a compact form factor. Additionally, the product aligns with the standard, soldering pitch of 0.35mm to expedite volume manufacturing using typical Surface Mount Technology (SMT) processes. Reliable, robust performance is assured, thanks to interior armor and insert-molded power nail, which safeguard pins from damage during volume manufacturing and assembly. These capabilities, along with wide alignment, facilitate easy, secure mating and lower fallout rates.   

High-Volume Production, Diverse Mix of Applications 

More than 50 million Quad-Row Connectors have been shipped since 2020 to support the highest-selling smartwatch worldwide. Molex’s meticulous attention to design for manufacturing has led to expedited volume manufacturing ramps. The connectors also support a bigger reel size, which can facilitate production efficiencies, leading to improved production yield rates.

In addition, the compact size and reliable performance of the Quad-Row Board-to-Board Connectors make them ideally suited for a variety of applications requiring increasingly smaller PCBs and flex assembles. The ability to meet product miniaturization demands creates nearly limitless opportunities for AR/VR, automotive, communications, consumer, defense, IoT, medical and wearable applications.

Availability  

Molex Quad-Row Board-to-Board Connectors are available worldwide in 32- and 36-pin configurations with 20- and 64-pin configurations coming soon. Plans are underway to support up to 100-pin counts.

Molex Consumer & Commercial Solutions 

The Molex legacy of delivering critical connections extends across the entire mobile device ecosystem with proven expertise in 5G, mmWave, RF, signal integrity, antenna, power, camera and display technologies. Precision, volume manufacturing and miniaturization enable Molex to meet dynamic market demands while providing leading mobile device manufacturers and their suppliers with the smallest, densest and most advanced connectors currently available.

About Molex 

Molex is a global electronics leader committed to making the world a better, more-connected placeWith a presence in more than 40 countries, Molex enables transformative technology innovation in the automotive, data center, industrial automation, healthcare, 5G, cloud and consumer device industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for LifeFor more information, visit www.molex.com. 

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

OPTIGA™ TPM SLB 9672 and SLB 9673 RPI Evaluation Boards
Sponsored by Mouser Electronics and Infineon
Security is a critical design concern for most electronic designs today, but finding the right security solution for your next design can be a complicated and time-consuming process. In this episode of Chalk Talk, Amelia Dalton and Andreas Fuchs from Infineon investigate how Infineon’s OPTIGA trusted platform module can not only help solve your security design concerns but also speed up your design process as well.
Jun 26, 2023
34,422 views