industry news
Subscribe Now

Molex Demonstrates Modular Automotive Connectivity (MAX) Platform at ELIV 2019

Solution enables high-quality vehicle networking

LISLE, IL –  October 10,  2019 – Molex (https://www.molex.com/molex/industry/connected-mobility/home?utm_source=prssorch&utm_medium=prrelease&utm_content=ELIV+&utm_campaign=automotive), a Tier 1 system integrator and leading supplier of high-speed networking, datacom, rugged industrial and automotive solutions that enable innovative architecture design and development for the intelligent vehicles of the future, will showcase its Modular Automotive Connectivity (MAX) (https://www.molex.com/molex/products/family?chanName=family&channel=products&key=vehicle_connectivity_platform&pageTitle=Introduction) solution in booth 151 at ELIV 2019 October 16-17 in Bonn, Germany.

MAX offers high-quality and affordable vehicle networking for both traditional and new mobility providers, utilizing two modules from u-blox (SIX:UBXN), a Swiss-based global provider of leading positioning and wireless communication technologies. MAX is ideally suited for small series, such as vans or targeted innovative EV projects. In addition, attendees can visit the eSync Alliance booth (booth 39) and will see a multi-vendor demonstration showing eSync OTA & data gathering architecture deployed with MAX serving as the secure client between various agents and cloud services. As a central node in the vehicle, MAX enables both internal and external networking. The solution is flexible, scalable and is an open software concept, fulfilling important requirements of the dynamic mobility market.

“MAX further supports our commitment to providing next gen connectivity in the car for the entire market, not just a luxury for premium automakers. Molex innovations and expertise are driving solutions that are changing the automotive landscape to allow our customers accessibility,” said Dietmar Schnepp, product director for vehicle communication devices, Molex.

“We are delighted to work with a world leader in the automotive market such as Molex and proud to see two u-blox modules at the core of the new MAX connectivity platform,” says Andreas Thiel, Head of Product Centers and Co-founder of u-blox. “This collaboration demonstrates u-blox’s dedication to providing automotive customers with best-in-class positioning and wireless communications solutions.”

MAX can be tailored to the customer’s requirements through individual configuration. The platform combines quality of state-of-the-art communication technologies with the necessary degree of standardization for cost control. In addition, the individual modularization enables a short time-to-market compared to tailor-made solutions. This path is the ideal alternative for telematics service providers who can use MAX as the basis for a backend connection, as well as for the development of various applications.

Optimal mobile network access and precise positioning support innovative mobility applications. Two modules from u-blox, the TOBY-L4 and NEO-M8L, are built into the MAX connectivity platform. TOBY-L4 supports the reception and transmission of data over the mobile network to the backend, enabling mobile Internet access. In addition, the Automotive Grade GNSS module NEO-M8L supports positioning, so that the ECU knows exactly where the vehicle is at all times. The solution can determine the position not only via GPS but also via Galileo, Beidou and Glonass. As a result, MAX can be deployed globally and offers a flexible and scalable solution for worldwide mobility providers, OEMs and system suppliers.

For more information about Molex, please visit booth 151 at ELIV or http://www.molex.com/connected-mobility.

About Molex:
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit www.molex.com.

Molex Resources:
•       Learn more about Molex at www.molex.com
•       Follow us at www.twitter.com/molexconnectors
•       Watch our videos at www.youtube.com/molexconnectors
•       Connect with us at www.facebook.com/molexconnectors
•       Read our blog at www.connector.com

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Automotive/Industrial PSoC™ High Voltage (HV) Overview
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Marcelo Williams Silva from Infineon explore the multitude of benefits of Infineon’s PSoC 4 microcontroller family. They examine how the high precision analog blocks, high voltage subsystem, and integrated communication interfaces of these solutions can make a big difference when it comes to the footprint size, bill of materials and functional safety of your next automotive design.
Sep 12, 2023
27,795 views