industry news
Subscribe Now

MIPI D-PHY v3.0 Doubles Data Rate of Physical Layer Interface While Extending Power Efficiency

C-PHY also enhanced with 64-bit PHY Protocol Interface to provide wider bus for high-performance applications

PISCATAWAY, N.J., September 2, 2021—The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a major update to its MIPI D-PHY specification for connecting megapixel cameras and high-resolution displays to application processors. Version 3.0 doubles the data rate of D-PHY’s standard channel to 9 Gigabits per second (Gbps), while extending the power efficiency of the specification for smartphone, Internet of Things (IoT) and automotive camera and display applications.

As the first MIPI PHY specification introduced more than 15 years ago, MIPI D-PHY has been broadly implemented as the physical-layer interface for cameras and displays in smartphones because of its cost-effective flexibility, high speed and low power. Due to these attributes, the specification has also been applied to a wide array of other use cases such as drones, very large tablets, surveillance cameras and industrial robots, as well as automotive applications, including camera sensing systems, collision avoidance radars, in-car infotainment and dashboard displays, with the support of proprietary bridging solutions.

D-PHY v3.0 doubles the specification’s speed to 9 Gbps for the standard channel (and 11 Gbps for its short channel), enabling support for the latest ultra-high-definition displays and beyond. In tandem with the boost in data rate, D-PHY v3.0 introduces a Continuous-Time Linear Equalizer (CTLE) on the receiver side of a connection to maintain the interface’s superior power efficiency. D-PHY v3.0 is fully compatible with previous versions of the MIPI specification.

“Pixel rates in camera and display applications are constantly increasing, and v3.0 of D-PHY provides the leap in data rate necessary to support next-generation image sensors while extending the specification’s low-power attribute,” said Joel Huloux, chairman of MIPI Alliance. “MIPI continues to innovate its PHY interfaces to enable advancements in camera and display applications and emerging market dynamics.”

In conjunction with the release of D-PHY v3.0, MIPI Alliance also announces version 2.1 of MIPI C-PHY, which provides high throughput and superior power efficiency to connect displays and cameras to application processors. The specification supports symbol rates up to 6 Gigasymbols per second (Gsps), equivalent to 13.7 Gbps, over the standard channel and up to 8 Gsps over the short channel. A new 64-bit PHY Protocol Interface (PPI) in v2.1 provides a wider bus between C-PHY and a chip’s core logic for better support of higher-performance applications. The new version of the interface is fully compatible with previous versions of C-PHY.

In addition to the added features, the new version of the C-PHY specification replaces objectionable terms with ones that more accurately reflect the functions of technical devices.

MIPI’s upcoming developers conference (MIPI DevCon), on 28-29 September 2021, will feature a variety of technical sessions and member demonstrations on MIPI specifications in application spaces such as mobile, the IoT, automotive and 5G. Please visit https://www.mipi.org/devcon/2021/register for complimentary registration.

To keep up with MIPI Alliance, subscribe to the MIPI blog and stay connected by following MIPI on TwitterLinkedInFacebook and YouTube.

About MIPI Alliance

MIPI Alliance (MIPI) develops interface specifications for mobile and mobile-influenced industries. There is at least one MIPI specification in every smartphone manufactured today. Founded in 2003, the organization has over 325 member companies worldwide and more than 15 active working groups delivering specifications within the mobile ecosystem. Members of the organization include handset manufacturers, device OEMs, software providers, semiconductor companies, application processor developers, IP tool providers, automotive OEMs and Tier 1 suppliers, and test and test equipment companies, as well as camera, tablet and laptop manufacturers. For more information, please visit www.mipi.org.

Leave a Reply

featured blogs
Sep 20, 2021
The Cadence Scholarship Program is the flagship CSR program of Cadence India, introduced five years ago. Many meritorious students from under-served sections of society drop out of the education... [[ Click on the title to access the full blog on the Cadence Community site. ...
Sep 18, 2021
Projects with a steampunk look-and-feel incorporate retro-futuristic technology and aesthetics inspired by 19th-century industrial steam-powered machinery....
Sep 15, 2021
Learn how chiplets form the basis of multi-die HPC processor architectures, fueling modern HPC applications and scaling performance & power beyond Moore's Law. The post What's Driving the Demand for Chiplets? appeared first on From Silicon To Software....
Aug 5, 2021
Megh Computing's Video Analytics Solution (VAS) portfolio implements a flexible and scalable video analytics pipeline consisting of the following elements: Video Ingestion Video Transformation Object Detection and Inference Video Analytics Visualization   Because Megh's ...

featured video

Maxim Integrated is now part of Analog Devices

Sponsored by Maxim Integrated (now part of Analog Devices)

What if we didn’t wait around for the amazing inventions of tomorrow – and got busy creating them today?

See What If: analog.com/Maxim

featured paper

What is a smart DAC?

Sponsored by Texas Instruments

See how to add simple logic and programmability to analog circuits, without writing, maintaining and qualifying software. These devices have built-in non-volatile memory and are factory programmable. They also include programmable state machines, PWM generators and custom waveform generators – all in a single device. This means that adding simple intelligence to your analog circuits no longer requires a microcontroller.

Click to read more

featured chalk talk

LED Lighting Solutions

Sponsored by Mouser Electronics and Amphenol ICC

LED lighting is revolutionizing lighting design. Engineers now need to consider a host of issues such as power consumption, spectrum, form factor, and reliability. In this episode of Chalk Talk, Amelia Dalton chats with Peter Swift from Amphenol ICC about the latest in LED lighting technology, and solutions for indoor and outdoor applications.

Click here for more about Amphenol Commercial Lighting Solutions ICC