industry news
Subscribe Now

Micron M29F 5V Parallel NOR Flash Products Now Available Direct From Alliance Memory

KIRKLAND, Wash., Sept. 10, 2020 (GLOBE NEWSWIRE) — Alliance Memory today announced that the company is now an authorized reseller for Micron’s M29F 5V parallel NOR Flash devices, which Micron previously discontinued with product change notification #32160 (last time buy: March 2018).  Micron is continuing to produce these devices for Alliance Memory and intends to only supply Alliance Memory for any new orders placed through mid-2021. Micron’s M29F devices are compatible with industry AM29F and MX29F devices, and a technical note is available from Micron’s website detailing how to migrate from AM29F devices to M29F devices.

“We are committed to meeting our customers’ legacy component needs and have had great success working with Micron to provide continued support for a variety of devices, including 512Mb SDRAMs and 8Gb DDR3L SDRAMs,” said David Bagby, president and CEO of Alliance Memory. “We’re looking forward to continuing that success with these M29F NOR Flash parts, which will provide our customers with a steady supply of 5V parallel NOR Flash for a minimum of two more years.”

“Micron is pleased to work with Alliance Memory to provide loyal customers of our M29F NOR Flash products with a trusted source for supply beyond our stated PCN last-time shipment date,” said Richard De Caro, director of NOR Flash and emerging memory solutions of the Embedded Business Unit at Micron. “We value our customers, and we always strive to find solutions that provide supply flexibility and longevity.”

The following Micron-made M29F 5V NOR Flash parts are now available directly from Alliance Memory:

Part number Density Boot type Configuration, speed, package option, temperature range, and shipping option
M29F200FB55M3F2 2Mb Bottom 256K x 8, 128K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F400FB55M3F2 4Mb Bottom 512K x 8, 256K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F400FB55N3E2 4Mb Bottom 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray
M29F400FB55N3F2 4Mb Bottom 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F400FT5AN6E2 4Mb Top 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tray
M29F800FB5AN6E2 8Mb Bottom 1M x 8, 512K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tray
M29F800FB5AN6F2 8Mb Bottom 1M x 8, 512K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tape & reel
M29F800FB55M3F2 8Mb Bottom 1M x 8, 512K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F800FT55N3E2 8Mb Top 1M x 8, 512K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray
M29F160FB5AN6F2 16Mb Bottom 2M x 8, 1M x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tape & reel
M29F160FT55N3E2 16Mb Top 2M x 8, 1M x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray

The AEC-Q100-certified components feature a 55ns access time. They are offered with -40°C to +85°C and -40°C to +125°C extended temperature ranges in the 48-pin TSOP and 44-pin SOP packages. Additional density and configuration options may be available upon request.

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America. More information about Alliance Memory is available online at www.alliancememory.com.

Leave a Reply

featured blogs
Aug 1, 2021
https://youtu.be/I0AYf5V_irg Made in Long Ridge Open Space Preserve (camera Carey Guo) Monday: HOT CHIPS 2021 Preview Tuesday: Designed with Cadence Video Series Wednesday: July Update Thursday:... [[ Click on the title to access the full blog on the Cadence Community site. ...
Jul 30, 2021
You can't attack what you can't see, and cloaking technology for devices on Ethernet LANs is merely one of many protection layers implemented in Q-Net Security's Q-Box to protect networked devices and transaction between these devices from cyberattacks. Other security technol...
Jul 29, 2021
Learn why SoC emulation is the next frontier for power system optimization, helping chip designers shift power verification left in the SoC design flow. The post Why Wait Days for Results? The Next Frontier for Power Verification appeared first on From Silicon To Software....
Jul 28, 2021
Here's a sticky problem. What if the entire Earth was instantaneously replaced with an equal volume of closely packed, but uncompressed blueberries?...

featured video

Vibrant Super Resolution (SR-GAN) with DesignWare ARC EV Processor IP

Sponsored by Synopsys

Super resolution constructs high-res images from low-res. Neural networks like SR-GAN can generate missing data to achieve impressive results. This demo shows SR-GAN running on ARC EV processor IP from Synopsys to generate beautiful images.

Click here for more information about DesignWare ARC EV Processors for Embedded Vision

featured paper

PrimeLib Next-Gen Library Characterization - Providing Accelerated Access to Advanced Process Nodes

Sponsored by Synopsys

What’s driving the need for a best-in-class solution for library characterization? In the latest Synopsys Designer’s Digest, learn about various SoC design challenges, requirements, and innovative technologies that deliver faster time-to-market with golden signoff quality. Learn how Synopsys’ PrimeLib™ solution addresses the increase in complexity and accuracy needs for advanced nodes and provides designers and foundries accelerated turn-around time and compute resource optimization.

Click to read the latest issue of Designer's Digest

featured chalk talk

Automotive Infotainment

Sponsored by Mouser Electronics and KEMET

In today’s fast-moving automotive electronics design environment, passive components are often one of the last things engineers consider. But, choosing the right passives is now more important than ever, and there is an exciting and sometimes bewildering range of options to choose from. In this episode of Chalk Talk, Amelia Dalton chats with Peter Blais from KEMET about choosing the right passives and the right power distribution for your next automotive design.

Click here for more information about KEMET Electronics Low Voltage DC Auto Infotainment Solutions