industry news
Subscribe Now

Micron M29F 5V Parallel NOR Flash Products Now Available Direct From Alliance Memory

KIRKLAND, Wash., Sept. 10, 2020 (GLOBE NEWSWIRE) — Alliance Memory today announced that the company is now an authorized reseller for Micron’s M29F 5V parallel NOR Flash devices, which Micron previously discontinued with product change notification #32160 (last time buy: March 2018).  Micron is continuing to produce these devices for Alliance Memory and intends to only supply Alliance Memory for any new orders placed through mid-2021. Micron’s M29F devices are compatible with industry AM29F and MX29F devices, and a technical note is available from Micron’s website detailing how to migrate from AM29F devices to M29F devices.

“We are committed to meeting our customers’ legacy component needs and have had great success working with Micron to provide continued support for a variety of devices, including 512Mb SDRAMs and 8Gb DDR3L SDRAMs,” said David Bagby, president and CEO of Alliance Memory. “We’re looking forward to continuing that success with these M29F NOR Flash parts, which will provide our customers with a steady supply of 5V parallel NOR Flash for a minimum of two more years.”

“Micron is pleased to work with Alliance Memory to provide loyal customers of our M29F NOR Flash products with a trusted source for supply beyond our stated PCN last-time shipment date,” said Richard De Caro, director of NOR Flash and emerging memory solutions of the Embedded Business Unit at Micron. “We value our customers, and we always strive to find solutions that provide supply flexibility and longevity.”

The following Micron-made M29F 5V NOR Flash parts are now available directly from Alliance Memory:

Part number Density Boot type Configuration, speed, package option, temperature range, and shipping option
M29F200FB55M3F2 2Mb Bottom 256K x 8, 128K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F400FB55M3F2 4Mb Bottom 512K x 8, 256K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F400FB55N3E2 4Mb Bottom 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray
M29F400FB55N3F2 4Mb Bottom 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F400FT5AN6E2 4Mb Top 512K x 8, 256K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tray
M29F800FB5AN6E2 8Mb Bottom 1M x 8, 512K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tray
M29F800FB5AN6F2 8Mb Bottom 1M x 8, 512K x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tape & reel
M29F800FB55M3F2 8Mb Bottom 1M x 8, 512K x 16, parallel, 55ns, 44-pin SOP, Automotive grade 3 (-40°C~125°C), tape & reel
M29F800FT55N3E2 8Mb Top 1M x 8, 512K x 16, parallel, 55ns 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray
M29F160FB5AN6F2 16Mb Bottom 2M x 8, 1M x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 6 (-40°C~85°C), tape & reel
M29F160FT55N3E2 16Mb Top 2M x 8, 1M x 16, parallel, 55ns, 48-pin TSOP, Automotive grade 3 (-40°C~125°C), tray

The AEC-Q100-certified components feature a 55ns access time. They are offered with -40°C to +85°C and -40°C to +125°C extended temperature ranges in the 48-pin TSOP and 44-pin SOP packages. Additional density and configuration options may be available upon request.

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes flash, DRAM, and SRAM memory ICs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in Kirkland, Washington, and regional offices in Europe, Asia, Canada, and South America. More information about Alliance Memory is available online at www.alliancememory.com.

Leave a Reply

featured blogs
Jun 8, 2023
Learn how our EDA tools accelerate 5G SoC design for customer Viettel, who designs chips for 5G base stations and drives 5G rollout across Vietnam. The post Customer Spotlight: Viettel Accelerates Design of Its First 5G SoC with Synopsys ASIP Designer appeared first on New H...
Jun 8, 2023
Radial compressors, also known as radial fans or blowers, are primarily used for compression purposes. Radial blades attached to a rotating impeller draw air into the unit's center. They are well-suited for high-pressure applications, where their efficient design can sav...
Jun 2, 2023
I just heard something that really gave me pause for thought -- the fact that everyone experiences two forms of death (given a choice, I'd rather not experience even one)....

featured video

Efficient Top-Level Interconnect Planning and Implementation with Synopsys IC Compiler II

Sponsored by Synopsys

This video shows how IC Compiler II and Fusion Compiler enable intelligent planning and implementation of complex interconnects through innovative Topological Interconnect Planning technology - accelerating schedules and achieving highest QoR.

Learn More

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

How IO-Link® is Enabling Smart Factory Digitization -- Analog Devices and Mouser Electronics
Safety, flexibility and sustainability are cornerstone to today’s smart factories. In this episode of Chalk Talk, Amelia Dalton and Shasta Thomas from Analog Devices discuss how Analog Device’s IO-Link is helping usher in a new era of smart factory automation. They take a closer look at the benefits that IO-Link can bring to an industrial factory environment, the biggest issues facing IO-Link sensor and master designs and how Analog Devices ??can help you with your next industrial design.
Feb 2, 2023
17,051 views