EEJournal

industry news
Subscribe Now
November 28, 2017

Merge the worlds of wired and wireless connectivity by connecting sensors to the cloud with new TI SimpleLink™ Ethernet MCUs

Simplify industrial gateway designs using new Ethernet MCUs with an integrated PHY leveraging 100 percent code compatibility across the SimpleLink MCU platform

DALLAS (Nov. 28, 2017) –Making it easier for developers to connect sensors from a gateway to the cloud, Texas Instruments (TI) (NASDAQ: TXN) today introduced Ethernet connectivity to the SimpleLink™ microcontroller (MCU) platform, a single hardware, software and tool platform for wired and wireless MCUs. The new SimpleLink MSP432™ Ethernet MCUs are based on a high-performance 120-MHz Arm® Cortex®-M4F core with an integrated MAC and PHY, helping accelerate time to market for grid infrastructure and industrial automation gateway applications. For more information, see www.ti.com/simplelinkethernet-pr.

Key features and benefits of SimpleLink Ethernet MCUs

  • Highly integrated wired MCU: Developers can reduce design time and simplify board layout with new MSP432E411Y MCUs, which integrate an Ethernet MAC and PHY, USB, Controller Area Network (CAN) and advanced cryptography accelerators.
  • Seamless, connected gateways: Engineers can now combine wired communications with the SimpleLink MSP432 host MCUs through integrated serial interfaces with wireless connectivity technology such as Sub-1 GHz, Wi-Fi® and Bluetooth® to connect end nodes to the cloud using the SimpleLink software development kit (SDK).
  • 100 percent application code compatibility: As part of the industry’s broadest portfolio of wired and wireless Arm MCUs, developers can use the same code base when designing end nodes and intelligent gateways using the new SimpleLink Ethernet MCUs for the grid, factories and buildings.

Designers can create a wireless sensor network using SimpleLink wireless MCUs by connecting as many as 50 secure sensor nodes to a gateway. The gateway, based on the SimpleLink Ethernet MSP432E4 MCUs, acts as a centralized management console to process and aggregate data and deliver it to the cloud via Ethernet for additional data analysis, visualization and storage. Companies developing these types of gateways can interface with existing wired installations while adding the latest wireless connectivity technologies.

For example, a heating, ventilation and air conditioning (HVAC) system can leverage other SimpleLink MCUs such as the Sub-1 GHz CC1310 wireless MCU and MSP432P4 host MCU to form a network of air-quality sensors and wired dampers to connect to an Ethernet-enabled HVAC system controller and then to the cloud. Users can then access real-time data to monitor and manage their energy profile. Learn more about the possibilities for HVAC systems and other applications in a new white paper.

Availability and pricing

Developers can get started immediately with SimpleLink Ethernet MCU-based development kits available through the TI store and authorized distributors. The MSP432E401Y MCU LaunchPad™ development kit (MSP-EXP432E401Y) is available for US$19.99.

Additionally, the MSP432E4 MCUs are available for mass production, priced at US$9.00 in 1,000-unit quantities.

Get more information about the SimpleLink MCU platform

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping approximately 100,000 customers transform the future, today. Learn more at www.ti.com.

About the SimpleLink MCU platform

The SimpleLink MCU platform from Texas Instruments is a single development environment that delivers flexible hardware, software and tool options for customers developing Internet of Things (IoT) applications. With a single software architecture, modular development kits and free software tools for every point in the design life cycle, the SimpleLink MCU ecosystem allows 100 percent code reuse across the portfolio of microcontrollers, which supports a wide range of connectivity standards and technologies including RS-485, Bluetooth low energy, Wi-Fi®, Sub-1 GHz, 6LoWPAN, Ethernet, RF4CE and proprietary radio frequencies. SimpleLink MCUs help manufacturers easily develop and seamlessly reuse resources to expand their portfolio of connected products. www.ti.com/simplelink.

Leave a Reply

featured blogs
Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System
Apr 24, 2024
Learn about maskless electron beam lithography and see how Multibeam's industry-first e-beam semiconductor lithography system leverages Synopsys software.The post Synopsys and Multibeam Accelerate Innovation with First Production-Ready E-Beam Lithography System appeared fir...
More from Synopsys...
DEI at Cadence: Celebrating Women's History Month
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
More from Cadence...
One Robotic Step Closer to Humanoid Robots in the Home
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
More from Max's Cool Beans...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Medical Grade Power
Sponsored by Mouser Electronics and RECOM
In this episode of Chalk Talk, Amelia Dalton and Louis Bouche from RECOM explore the various design requirements for medical grade power supplies. They also examine the role that isolation and leakage current play in this arena and the solutions that RECOM offers in terms of medical grade power supplies.
Click here for more information about RECOM Power Medical Power Supplies
Nov 9, 2023
21,598 views