industry news
Subscribe Now

Marvell Unveils Industry’s Lowest Power PCIe Gen4 NVMe SSD Controllers

Offers unparalleled performance-power benefits for emerging edge computing and cloud data center applications

Santa Clara, California (August 1, 2019) – Marvell (NASDAQ:MRVL) today released the industry’s lowest power PCIe® Gen4 NVMe™ solid-state drive (SSD) controller portfolio.  Marvell’s newest SSD controllers are designed to meet the need for lower power and higher performance in next-generation data centers and edge devices as artificial intelligence (AI) and 5G gain momentum.  This breakthrough technology delivers unparalleled performance in an ultra-compact footprint, leveraging the company’s complex system-on-chip (SoC) design expertise and groundbreaking storage IP to help data center, notebook, tablet, gaming and edge computing platform architects advance their solutions for the highly distributed data era.

“Marvell’s latest family of storage controllers has been architected to optimally address edge computing and data center pain points of power-performance and capacity-performance,” said Nigel Alvares, vice president of marketing for the Flash Business Unit at Marvell Semiconductor, Inc.  “With today’s launch, we’re once again demonstrating Marvell’s leadership in storage, delivering the industry’s first 4-Channel PCIe Gen4 NVMe SSD controllers with the industry’s lowest power consumption that will help revolutionize SSD solutions for the data economy.”

Ecosystem Support

“AMD recently introduced the world’s first PCIe® 4.0 ready desktop PC platform, the 3rd Generation AMD Ryzen™ processor and AMD X570 chipset for socket AM4,” said Chris Kilburn, corporate vice president and general manager, Client Channel, AMD. “We are delighted with the Marvell DRAM-less PCIe Gen4 SSD controller helping bring the increased bandwidth and performance required to elevate the user experience with next generation computing devices.”

“As a strategic storage partner of Lenovo, we are dedicated to transforming our customers’ experience with technology innovation,” said JP Yang, general manager of SSD BU, Union Memory (a Lenovo company).  “The PCIe Gen4 host interface, high-speed 1200MT/s NAND flash interface and low power 12nm technology of the Marvell SSD controllers support our vision of bringing significant value with superior power-performance in small form factors, low latency for fast wake-up and prolonged battery life operation.”

“We have worked closely with Marvell to validate Micron’s high-performance, 96-layer NAND components supporting 1.2 GT/s interface with its PCIe Gen4 SSD controller family,” said Arie Tal, senior director of business development for the Consumer and Components Group at Micron Technology. “Marvell’s optimized controllers will allow our mutual customers to deliver innovative, low-power, small form factor SSD solutions for emerging data center, edge computing and PC OEM use cases.”

“Marvell and Toshiba Memory Corporation have a strong established relationship delivering best-in-class SSD offerings for markets that span client to cloud data center,” said Hiroo Ohta, technology executive, Toshiba Memory Corporation.  “We believe Marvell’s PCIe Gen4 controller product family combined with our TLC, QLC and XL-FLASH BiCS FLASH™ Gen. 4 devices will enable new edge and data center storage architecture solutions utilizing flash technology.”

Advancing Next-Generation Technology

The Marvell SSD controller portfolio of devices, including the 88SS1321, 88SS1322 and 88SS1323, represent the industry’s first PCIe Gen4 DRAM and DRAM-less SSD controllers to be fabricated on a 12nm process.  With support covering all existing and emerging m.2 (22110 to 2230), BGA, EDSFF and U.2 SSD form factors, the controller family is ideal for cloud data center server compute storage, enterprise boot drives, PC client storage and gaming storage as well as emerging industrial and edge device applications.

Importantly, the new Marvell solutions will enable next-generation 3D and QLC NAND devices that maximize cost efficiency and reduce total cost of ownership.  The ultra-compact DRAM-less controller architecture allows for a stand-alone SSD controller and NAND unit to be mounted side-by-side on a single-sided ultra-compact m.2230 form factor SSD.  This significant space savings enables platform OEMs more room to house battery packs versus m.2280 SSDs, while also providing better performance compared to PCIe Gen 3×4 SSDs and lower power consumption compared to eight NAND channel controller-based SSDs.

Marvell’s revolutionary SSD controllers are available for sampling today.  For more information, please visit: https://www.marvell.com/storage/ssd/88ss1321-1323/

Marvell will showcase its SSD controller product line at the Flash Memory Summit, August 6-8, at the Santa Clara Convention Center (Expo Booth #511, Exhibit Hall A).  Nigel Alvares’ conference keynote, “Innovative Chipset Solutions for Accelerating the Data Economy” takes place on August 7 at 2:10 p.m.

About Marvell

Marvell first revolutionized the digital storage industry by moving information at speeds never thought possible. Today, that same breakthrough innovation remains at the heart of the company’s storage, processing, networking, security and connectivity solutions. With leading intellectual property and deep system-level knowledge, Marvell’s semiconductor solutions continue to transform the enterprise, cloud, automotive, industrial, and consumer markets. To learn more, visit: https://www.marvell.com/

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

PIC32CX-BZ2 and WBZ451 Multi-Protocol Wireless MCU Family
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU Family and how it can make IoT design easier than ever before. They investigate the components included in this multi-protocol wireless MCU family, the details of the software architecture included in this solution, and how you can utilize these MCUs in your next design.
May 4, 2023
40,870 views