industry news
Subscribe Now

MagnaChip Launches 28-Nanometer OLED DDIC for Smartphone Displays

SEOUL, South Korea and SAN JOSE, Calif., April 16, 2019 — MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it has launched the 28-nanometer (nm) OLED (Organic Light Emitting Diodes) DDIC (Display Driver IC) for smartphone displays.

The 28nm process is the most advanced process used for manufacturing OLED DDICs today.  MagnaChip’s new 28nm OLED DDIC achieves a form factor reduction that is 20 percent smaller than that of the previous 40nm process and is suitable for smartphones and other mobile devices, where small size and thinness are critical factors.  In addition, MagnaChip reduced the logic voltage from 1.1V, which was required for the existing 40nm products, to 1.0V, which reduces the current voltage consumption by more than 20 percent and also extends battery life.  MagnaChip’s latest 28nm OLED DDIC provides Best-In-Class performance, power and feature with high performance/price value.

With the addition of this new 28nm platform OLED DDIC, MagnaChip now has developed a portfolio of nine advanced platform OLED Display Driver ICs, including one 110nm rigid bezel-less, two 55nm flexible bezel-less and five 40nm rigid bezel-less OLED DDICs.  MagnaChip’s product roadmap includes plans to expand the feature set of OLED DDICs to include Ultra-High-Definition (UHD) capabilities.

The 28nm OLED display driver IC also is expected to improve the call quality of smartphones by reducing EMI (Electromagnetic Interference) levels by 20 percent, as compared to existing products based on the 40nm format.  The 28nm new OLED driver IC supports various display types such as rigid, flexible, foldable and VR, AR applications.  It also maximizes design flexibility for latest full-screen displays, such as bezel-less, hole type displays.  This new display driver already has won its first design-in at a leading smartphone manufacturer.

YJ Kim CEO of MagnaChip said: “By launching the 28nm OLED DDIC, we have demonstrated again our world-class technology and expect it will help mobile device manufacturers develop new generations of smaller and more energy-efficient products with crisp displays.  Further, MagnaChip plans to extend its DDIC portfolio from current OLED smartphones to the rapidly growing OLED TV, OLED automotive and MicroLED TV applications, as well as foldable smartphones.”

About MagnaChip Semiconductor

MagnaChip is a designer and manufacturer of analog and mixed-signal semiconductor platform solutions for communications, IoT, consumer, industrial and automotive applications.  The company’s Standard Products Group and Foundry Services Group provide a broad range of standard products and manufacturing services to customers worldwide.  MagnaChip, with about 40 years of operating history, owns a portfolio of approximately 3,000 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. For more information, please visit www.magnachip.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Current Sense Shunts
Sponsored by Mouser Electronics and Bourns
In this episode of Chalk Talk, Amelia Dalton and Scott Carson from Bourns talk about the what, where and how of current sense shunts. They explore the benefits that current sense shunts bring to battery management and EV charging systems and investigate how Bourns is encouraging innovation in this arena.
Jan 23, 2024
13,117 views