industry news
Subscribe Now

Magnachip Debuts New Family of 600V SJ MOSFET Products Featuring Fast Recovery Body Diodes

Magnachip introduces new 600V SJ MOSFET with RDS(on)* as low as 44mΩ for EV chargers and servers

SEOUL, South Korea, May 2, 2023 – Magnachip Semiconductor Corporation (“Magnachip” or “Company”) (NYSE: MX) announced today that the Company has released a new family of 600V Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs) consisting of nine distinct products featuring proprietary design technology.

Magnachip’s proprietary design provides specific on-resistance (RSP) reduction of about 10%, and this result was achieved while maintaining the same cell-pitches of previous generation MOSFETs.

In addition, the new product family of 600V SJ MOSFETs is equipped with a fast recovery body diode. This diode technology significantly enhances system efficiency with reduced reverse recovery time (trr) and switching loss. Therefore, the figure of merit to evaluate general performance of MOSFETs was improved by more than 10% compared to the previous generation. As such, these 600V SJ MOSFETs can be used widely in industrial applications, such as solar inverters, energy storage systems, uninterruptible power supply systems, and a variety of electronics.

Among these new MOSFETs, the MMQ60R044RFTH product offers an exceptionally low RDS(on) of 44mΩ, making it an optimal choice for electric vehicle chargers and servers. Omdia, a global market research firm, estimates that the compound annual growth rates of Si MOSFET markets for hybrid & electric vehicles and servers will be 11% and 7%, respectively, from 2023 to 2026.

“Now that we have introduced these 600V SJ MOSFET products, we are aiming to unveil new 650V and 700V SJ MOSFET products with fast recovery body diode in the second half of 2023,” said YJ Kim, CEO of Magnachip. “These new MOSFETs represent a notable achievement for the Company, and we will build upon this success to deliver next-generation power solutions for rapidly changing market requirements and customer expectations.”

Leave a Reply

featured blogs
Jun 13, 2024
I've just been introduced to the DuoFlex 4K Dual-Screen Display from HalmaPixel, and now I'm drooling with desire all over my keyboard....

featured video

Unleashing Limitless AI Possibilities with FPGAs

Sponsored by Intel

Industry experts discuss real-world AI solutions based on Programmable Logic, or FPGAs. The panel talks about a new approach called FPGAi, what it is and how it will revolutionize how innovators design AI applications.

Click here to learn more about Leading the New Era of FPGAi

featured paper

Navigating design challenges: block/chip design-stage verification

Sponsored by Siemens Digital Industries Software

Explore the future of IC design with the Calibre Shift left initiative. In this paper, author David Abercrombie reveals how Siemens is changing the game for block/chip design-stage verification by moving Calibre verification and reliability analysis solutions further left in the design flow, including directly inside your P&R tool cockpit. Discover how you can reduce traditional long-loop verification iterations, saving time, improving accuracy, and dramatically boosting productivity.

Click here to read more

featured chalk talk

TE Connectivity MULTIGIG RT Connectors
In this episode of Chalk Talk, Amelia Dalton and Ryan Hill from TE Connectivity explore the benefits of TE’s Multigig RT Connectors and how these connectors can help empower the next generation of military and aerospace designs. They examine the components included in these solutions and how the modular design of these connectors make them a great fit for your next military and aerospace design.
Mar 19, 2024