industry news
Subscribe Now

KLA-Tencor Announces VoyagerTM 1015 and Surfscan® SP7 Defect Inspection Systems: Addressing Two Key Challenges in Process and Tool Monitoring

MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes. The VoyagerTM 1015 system offers new capability to inspect patterned wafers, including inspection in the lithography cell immediately after development of the photoresist, when the wafer can be reworked. The Surfscan® SP7 system delivers unprecedented defect detection sensitivity on bare wafers, smooth and rough films—essential for manufacturing silicon substrates intended for the 7nm logic and advanced memory device nodes, and equally critical for earliest detection of process issues during chip manufacturing. Together the two new inspection systems are designed to accelerate time-to-market for innovative electronic devices by capturing defect excursions at their source.

“With leading IC technologies, wafer and chip manufacturers have very little room for error,” said Oreste Donzella, Senior Vice President and Chief Marketing Officer at KLA-Tencor. “Critical dimensions of next-generation chips are so small that the minimum size of a yield-killing defect on bare silicon wafers or blanket-film monitor wafers has shrunk below the detection limit of available tool monitoring systems. A second key gap in the defect detection space has been reliably detecting yield-killing defects introduced early in the lithography process, whether 193i or EUV. Our engineering teams have developed two new defect inspection systems—one for unpatterned/monitor wafers and one for patterned wafers—that provide key capability for engineers to address these difficult defect issues rapidly and accurately.”

The Surfscan SP7 unpatterned wafer defect inspection system achieves its game-changing sensitivity through substantial innovations in illumination and sensor architecture that produce decades of improvement in resolution over that of the previous-generation, market-leading Surfscan tool. This unprecedented leap in resolution is the key to detection of the smallest killer defects. The new resolution realm also enables real-time classification of many defect types, such as particles, scratches, slip lines and stacking faults—without removing the wafer from the Surfscan tool or affecting the system throughput. At the same time, exquisite control over peak power density allows the Surfscan SP7 to inspect thin, delicate EUV photoresist materials.

The Voyager 1015 patterned wafer defect inspection system closes a long-standing industry gap in after-develop inspection (ADI), leveraging novel illumination, collection and sensor architecture. This revolutionary laser scattering inspection system drives sensitivity forward while reducing nuisance signals—and delivers results substantially sooner than the next-best alternatives. Like the new Surfscan SP7, the Voyager system features exceptional control of power density, allowing inline inspection of delicate photoresist materials after develop. High throughput capture of critical defects in the litho cell and other modules of the fab allows process issues to be identified and rectified rapidly.

The first Surfscan SP7 and Voyager 1015 systems have been operating at leading wafer, equipment and chip manufacturers worldwide, where they work together with KLA-Tencor’s eDR® electron-beam review systems and Klarity® data analytics systems to identify process control issues at the source. To maintain the high performance and productivity demanded by wafer and chip manufacturers, the Voyager and Surfscan SP7 systems are backed by KLA-Tencor’s global comprehensive service network. More information about the two new defect inspection systems can be found on the Voyager 1015-Surfscan SP7 launch information page.

About KLA-Tencor:

KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers more than 40 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at www.kla-tencor.com (KLAC-P).

2 thoughts on “KLA-Tencor Announces VoyagerTM 1015 and Surfscan® SP7 Defect Inspection Systems: Addressing Two Key Challenges in Process and Tool Monitoring”

Leave a Reply

featured blogs
Jun 2, 2023
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Jun 2, 2023
I just heard something that really gave me pause for thought -- the fact that everyone experiences two forms of death (given a choice, I'd rather not experience even one)....
Jun 2, 2023
Explore the importance of big data analytics in the semiconductor manufacturing process, as chip designers pull insights from throughout the silicon lifecycle. The post Demanding Chip Complexity and Manufacturing Requirements Call for Data Analytics appeared first on New Hor...

featured video

Synopsys Solution for RTL to Signoff Power Analysis

Sponsored by Synopsys

Synopsys’ industry-leading power analysis solution built on PrimePower technology that enables early RTL exploration, low power implementation and power signoff for design of energy-efficient SoCs.

Learn more about Synopsys’ Energy-Efficient SoCs Solutions

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

NXP GoldVIP: Integration Platform for Intelligent Connected Vehicles
Today’s intelligent connected vehicle designs are smarter and safer than ever before and this has a lot to do with a rapidly increasing technological convergence of sensors, machine learning, over the air updates, in-vehicle high bandwidth networking and more. In this episode of Chalk Talk, Amelia Dalton chats with Brian Carlson from NXP about NXP’s new GoldVIP Platform. They examine the benefits that this kind of software integration platform can bring to automotive designs and how you can take a test drive of the GoldVIP for yourself.
Nov 29, 2022
24,694 views