industry news
Subscribe Now

Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIeä Standard

  • Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of chiplets
  • Models and simulates UCIe-based compliance measures such as voltage transfer function
  • Leverages Keysight EDA’s technology and history of success simulating complex physical layer standards such as SerDes and memory

January 24, 2024

SANTA ROSA, Calif., – Keysight Technologies, Inc. (NYSE: KEYS) introduces Chiplet PHY Designer, the latest member in its family of high speed digital design and simulation tools that provides die-to-die (D2D) interconnect simulation, which is a key step in verifying performance for heterogeneous and 3D integrated circuit (IC) designs commonly referred to as chiplets. The new electronic design automation (EDA) tool is the industry’s first to provide in-depth modeling and simulation capabilities that enable chiplet designers to rapidly and accurately verify that their designs meet specifications of the Universal Chiplet Interconnect Expressä (UCIeä) standard.

UCIe is emerging as the leading chiplet interconnect specification in the semiconductor industry. It is an open standard that defines the interconnect between chiplets within an advanced 2.5D or 3D package. UCIe is in process of being supported or adopted by many of the top semiconductor equipment and EDA tool vendors as well as foundries and chiplet designers. Designers who use the interconnect standard and ensure their chiplets perform to its specifications are helping establish a broad ecosystem for chiplet interoperability and commerce.

Keysight EDA’s research and development team has been working on modeling and simulating high-speed digital interfaces aligned with industry specifications for decades. For example, ADS Memory Designer offers comprehensive memory interface coverage such as GDDR7, DDR5, LPDDR5, and HBM3 with its IBIS-AMI modeler. Its rigorous and genuine JEDEC compliance test solution handles over 100 test IDs with the same test algorithm found in the Keysight Infinium oscilloscope family.

Key features of the Chiplet PHY Designer physical-layer simulator include:

  • Supports UCIe physical layer standard – automated parsing of signals following the standard naming conventions, automated connections between multiple dies through package interconnects, standard driven simulation setup such as speed grade, and intuitive measurement setup through specialized probe component.
  • Measurement of voltage transfer function (VTF) – precisely computes a VTF to ensure UCIe specification compliance and analyzes system bit error rate (BER) down to 1e-27 or 1e-32 levels. Measures eye diagram height, eye width, skew, mask margin, and BER contour.
  • Analysis of forwarded clocking to accurately capture the asynchronous clocking behavior.

Adrien Auge, Senior Staff Applications Engineer, Alphawave Semi, said: “The ability to validate Alphawave Semi’s chiplet solutions is crucial for enabling a future of heterogenous chip design, as it ensures seamless operation and interoperability for 2.5D/3D solutions available to our customers. Chiplet PHY Designer simplifies the electrical simulation process for large die-die electrical connectivity, such as UCIe. It provides engineers and designers a quick and easy path to extract electrical compliance of their solutions against the latest revision of the specification. Furthermore, by complying with the latest IBIS modeling specification for electrical I/O, physical integrators can delve deeper into the chiplet electrical validation process, leveraging our detailed models to obtain pre-silicon performance predictions.”

Niels Faché, Vice President and General Manager, Keysight EDA, said: “Our high-speed digital simulation team capitalized on its understanding of the shift left challenges presented by SerDes PHYS. They have applied these learnings to the chiplet domain to extend success of our standards-based simulation strategy to UCIe. Interconnect modeling is critical to system design and performance. Chiplet PHY Designer accelerates validation of chiplet subsystems, from one D2D PHY through interconnect channels to another D2D PHY, much earlier in the design cycle. It enables 3D IC designers to solve critical interconnect performance problems improving predictive virtual prototyping to speed time-to-market.”

See Chiplet PHY Designer at DesignCon

Keysight will be demonstrating Chiplet PHY Designer in its DesignCon booth #1039 at the Santa Clara Convention Center from January 31-February 1, 2024.

For more information, visit: Chiplet PHY Designer 

About Keysight Technologies

At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

IoT Data Analysis at the Edge
No longer is machine learning a niche application for electronic engineering. Machine learning is leading a transformative revolution in a variety of electronic designs but implementing machine learning can be a tricky task to complete. In this episode of Chalk Talk, Amelia Dalton and Louis Gobin from STMicroelectronics investigate how STMicroelectronics is helping embedded developers design edge AI solutions. They take a closer look at the benefits of STMicroelectronics NanoEdge-AI® Studio and  STM32Cube.AI and how you can take advantage of them in your next design. 
Jun 28, 2023
35,663 views