industry news
Subscribe Now

Infineon’s highly integrated new wireless power transmitter IC is ideal for charging applications up to 50 W

Munich, Germany – 4 May, 2023 – Wireless charging has become an integral part of the modern battery-powered world, providing a streamlined and user-friendly experience for portable products across a wide range of industries. With the WLC1150 wireless charging transmitter IC, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its portfolio of wireless charging (WLC) controller ICs, offering a highly integrated, easy-to-design, and cost-effective solution for applications requiring higher wireless power transfer. These include industrial applicationshealthcare equipmentrobotics and dronesvacuum cleanerspower tools, docking stations, and smartphone chargers supporting Qi Extended Power Profile (EPP).

The WLC1150 transmitter is designed to meet the critical requirements of such applications by providing high efficiency, flexible thermal management options, low electromagnetic interference (EMI), integrated adaptive foreign object detection (FOD), inverter control, and several other features. The WLC1150 uses multiple methods to tune the adaptive FOD, including Q-factor, resonant frequency and power.

The transmitter supports 50 W wireless power transfer using a high-power proprietary charging protocol and a wide input voltage range of 4.5 to 24 V. The integrated fan buck controller enables thermal management by cooling the interface surface during high-power delivery. It also includes integrated gate drivers for the inverter, which is controlled by frequency, duty cycle, and variable voltage.

It also integrates a USB type-C power delivery (PD) controller that supports the latest version of USB-PD 3.1 with programmable power supply (PPS) mode. The WLC1150 complies with the WPC Qi 1.3 with EPP, basic power profile (BPP), and proprietary power delivery extension (PPDE). It supports systems with input power supplied from either USB PD/PPS or fixed input from a DC power supply. With either input configuration, the transmitter does not require a front-end DC-DC converter. This helps to significantly improve system efficiency.

Adjustable over-voltage protection (OVP), over-current protection (OCP), and over-temperature protection (OTP) are also supported. The WLC1150 transmitter IC can be paired with the upcoming WLC1250 receiver IC to realize end-to-end proprietary wireless power transfer solutions.

The WLC1150 is based on a programmable 32-bit Arm® Cortex®-M0 processor equipped with 128 KB Flash, 16 KB RAM, and various peripherals such as ADC, PWMs, and timers. Its full-stack firmware has many configurable options that allow customization of application-specific FOD, in-band communication, sensing, protection, and other system parameters. This is made possible by an easy-to-use graphical user interface (GUI) that eliminates the need for code debugging and streamlines the configuration process. Combined with Infineon’s ModusToolbox™, the WLC1150’s programmable features enable the development of distinct and scalable wireless charging solutions for proprietary protocols as well as the latest Qi specification.

Availability

The highly integrated wireless charging transmitter IC WLC1150 for high power applications is available in a 68 pin 8 x 8 mm² in tray, as well as tape and reel packages, and can be ordered now. More information is available at www.infineon.com/wirelesscharging-ics. The WLC1150 will be showcased at PCIM Europe 2023.

Infineon at the PCIM 2023

At the PCIM Europe 2023 tradeshow, Infineon is showcasing innovative product-to-system solutions for applications that will power the world and shape the future. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Industry & E-Mobility Forum with live and on-demand video presentations, followed by discussions with the speakers. “Driving decarbonization and digitalization. Together.” at the Infineon booth #412 in hall 7, 9-11 May, 2023 in Nuremberg/Germany. Information about the PCIM Europe 2023 show highlights is available at www.infineon.com/pcim.

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 26, 2023
5G coverage from space has the potential to make connectivity to the Internet truly ubiquitous for a broad range of use cases....
Sep 26, 2023
Explore the LPDDR5X specification and learn how to leverage speed and efficiency improvements over LPDDR5 for ADAS, smartphones, AI accelerators, and beyond.The post How LPDDR5X Delivers the Speed Your Designs Need appeared first on Chip Design....
Sep 26, 2023
The eighth edition of the Women in CFD series features Mary Alarcon Herrera , a product engineer for the Cadence Computational Fluid Dynamics (CFD) team. Mary's unwavering passion and dedication toward a career in CFD has been instrumental in her success and has led her ...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

featured video

TDK PowerHap Piezo Actuators for Ideal Haptic Feedback

Sponsored by TDK

The PowerHap product line features high acceleration and large forces in a very compact design, coupled with a short response time. TDK’s piezo actuators also offers good sensing functionality by using the inverse piezo effect. Typical applications for the include automotive displays, smartphones and tablet.

Click here for more information about PowerHap Piezo Actuators

featured paper

Accelerating Monte Carlo Simulations for Faster Statistical Variation Analysis, Debugging, and Signoff of Circuit Functionality

Sponsored by Cadence Design Systems

Predicting the probability of failed ICs has become difficult with aggressive process scaling and large-volume manufacturing. Learn how key EDA simulator technologies and methodologies enable fast (minimum number of simulations) and accurate high-sigma analysis.

Click to read more

featured chalk talk

NXP GoldVIP: Integration Platform for Intelligent Connected Vehicles
Today’s intelligent connected vehicle designs are smarter and safer than ever before and this has a lot to do with a rapidly increasing technological convergence of sensors, machine learning, over the air updates, in-vehicle high bandwidth networking and more. In this episode of Chalk Talk, Amelia Dalton chats with Brian Carlson from NXP about NXP’s new GoldVIP Platform. They examine the benefits that this kind of software integration platform can bring to automotive designs and how you can take a test drive of the GoldVIP for yourself.
Nov 29, 2022
36,184 views