industry news
Subscribe Now

Infineon’s CoolSiC™ XHP™ 2 high-power modules enable energy-efficient electrified trains to drive decarbonization

Munich, Germany – 8 May, 2023 – To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains. Trains, however, have demanding operating profiles with frequent acceleration and braking, while being expected to operate reliably over a long service life. Consequently, energy-efficient traction applications with high-power density, reliability, and quality are required for implementation.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is addressing these requirements by adding two new products to its CoolSiC™ power module portfolio: the FF2000UXTR33T2M1 and the FF2600UXTR33T2M1. The power modules use newly developed 3.3 kV CoolSiC MOSFETs and Infineon’s interconnection technology .XT. The modules come in XHP™2 package and have been specifically tailored for traction applications.

Designed for demanding applications such as traction, these devices will be presented at this year’s PCIM conference in Nuremberg, Germany. “For environmentally friendly mobility, rail technology requires innovative semiconductor solutions designed specifically for these applications,” said Dr. Peter Wawer, Division President of Infineon’s Green Industrial Power Division. “With low switching losses and the ability to enable higher switching frequencies, Infineon’s new silicon carbide products contribute to greener and quieter trains, which are extremely important features for tomorrow’s train traffic.”

In addition to an efficient and robust silicon carbide (SiC) chip, power modules for traction drives require packaging that allow fast switching, along with interconnection technologies that enable a long service life time. Infineon’s new power modules offer these exact features: The CoolSiC MOSFET chips with integrated body diodes in Infineon’s XHP 2 packaging enable low switching losses while maintaining high reliability and power density.

The XHP 2 packaging also features low stray inductance, a symmetrical and scalable design, and high current carrying capability. The FF2000UXTR33T2M1 module offers a drain-source-on-state resistance of 2.0 mΩ, while the FF2600UXTR33T2M1 features a drain-source-on-state resistance of 2.6 mΩ. Despite the demanding operating profiles of trains, Infineon’s .XT interconnect technology improves power cycling capabilities.

Compared to conventional solutions, Infineon’s CoolSiC power modules enable overall energy consumption in the motor and converter of the train to be reduced by ten percent. Additionally, train operators benefit from a more compact, lighter converter, along with a simplified cooling systems. While this is paying into the decarbonization efforts of Infineon, traction manufacturers and railway service operators, citizens also benefit from lower noise levels when trains go through a neighborhood. An Infineon SiC-based XHP 2 power module has been proven in a joint field test with streetcars conducted by Siemens Mobility and Stadtwerke München (SWM) in 2022. The test has shown that power semiconductors based on SiC significantly reduce engine noise during operation.

Availability

The CoolSiC XHP 2 3,3 kV high-power modules are available as samples for selected customers.

Infineon at PCIM 2023

At the PCIM Europe 2023 tradeshow, Infineon is showcasing innovative product-to-system solutions for applications that will power the world and shape the future. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Industry & E-Mobility Forum with live and on-demand video presentations, followed by discussions with the speakers. “Driving decarbonization and digitalization. Together.” at the Infineon booth #412 in hall 7, 9-11 May, 2023 in Nuremberg/Germany. Information about the PCIM Europe 2023 show highlights is available at www.infineon.com/pcim.

More information about Infineon’s contribution to energy efficiency: www.infineon.com/green-energy

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
32,531 views