Munich, Germany – 30 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced that its radiation-hardened 512 Mbit QSPI NOR Flash memory for space and extreme environment applications has now received the QML-V and QML-P qualification of the Defense Logistics Agency Land and Maritime (DLAM). The QML certification is the highest reliability standard for microcircuits awarded by the U.S. government and indicates that the device will perform reliably under the most challenging conditions. This makes the memory device the first and only QML-qualified radiation-hardened NOR flash memory for the space industry. The flash memory features a fast 133 MHz quad serial peripheral interface (QSPI) and the highest density, radiation and single-event effects (SEE) performance available in a fully QML-qualified non-volatile memory for use with space-qualified FPGAs and multi-core processors.
“The introduction of our first QML-P certified product is further testament to our commitment to deliver highly reliable and high-performance memories for next-generation space requirements,” said Helmut Puchner, Vice President, Fellow, Aerospace and Defense, Infineon Technologies. “Our in-house developed SONOS technology is an ideal solution for radiation and power limited environments. Further higher density NOR Flash products as well as AI/ML targeted compute-in-memory solutions are already in progress to further utilize our SONOS technology in these highly critical satellite applications.”
The device leverages Infineon’s proven SONOS (silicon-oxide-nitride-oxide-silicon) technology, which combines high density and speed with excellent radiation performance. With this, the device operates at speeds up to 30 percent faster than lower density alternatives. The technology also enables a lifespan of up to 10,000 P/E cycles and data retention for up to 10 years. In addition, the 133 MHz QSPI interface provides fast data transfer rates for space-grade FPGAs and processors. A ceramic QFP package (QML-V) occupies a 1“ x 1” board area, and an even smaller plastic TQFP package (QML-P) with a 0.5“ x 0.8” footprint is also available. In addition, the device offers the highest density and TID/SEE performance for space FPGA and multi-core processor boot code solutions and the QML-V/P with DLAM certification meets the most stringent industry qualifications. With all these features, the device is particularly suitable for storing configuration images for space-grade FPGAs and for standalone storage of boot code for space-qualified multi-core processors.
Availability
The Infineon DLAM QML-V/-P-qualified 512 Mbit QSPI NOR Flash is now available. More information is available at https://www.infineon.com/cms/en/product/promopages/512MbNORFlash/.
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 58,060 employees worldwide (end of September 2024) and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
