industry news
Subscribe Now

Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs

Munich, Germany – 17 March 2025 – Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing the E-version of its hybrid flyback controller family. Designed for high-performance applications, the new XDP™ hybrid flyback digital controller family leverages the advanced asymmetrical half-bridge (AHB) topology, which combines the simplicity of a flyback converter with the efficiency of a resonant converter, enabling high power density designs. This makes the controllers ideal for various AC/DC applications, including aftermarket and OEM chargers, adapters, power tools, e-bike chargers, industrial switching power supplies, TV power supplies, and LED drivers.

The hybrid flyback topology offers several advantages over active clamp flyback (ACF) and LLC resonant converters. It reduces magnetic energy storage and operates with lower leakage inductance, resulting in a smaller transformer size. HFB achieves high efficiency across a wide output range and minimizes power losses through multimode operation, reducing standby power consumption and improving efficiency at low loads for compliance with Certificate of Conformity (CoC) Tier 2 and Department of Energy (DoE) 7 regulations. These characteristics make HFB well-suited for compact, efficient power supply designs. With patent-pending improved PFC features, synchronized PFC and HFB start-up behavior, and optimization for the latest CoolGaN™ transistors, the E-version of the hybrid flyback ICs further enhances performance in power conversion applications. Furthermore, simplified parameter configuration, along with a comprehensive design tool and design guide, supports efficient implementation in advanced designs.

Information on this technology will be available at the Infineon booth at 2025 APEC (March 16-20) in Atlanta, GA. Featured products include an ultra-compact 140 W GaN charger, 120 W multiport charger solutions with excellent standby and partial load efficiency, and the ultra-slim 400 W power supply unit with over 97 percent efficiency for DC-DC voltage conversion.

Learn more about the E-version XDP hybrid flyback controller ICs from Infineon here.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 58,060 employees worldwide (end of September 2024) and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Leave a Reply

featured blogs
Apr 4, 2025
Gravitrams usually employ a chain or screw lift to hoist their balls from the bottom to the top, but why not use a robot?...

featured chalk talk

nRF54L Series SoCs
In this episode of Chalk Talk, Pawel Kanafek from Nordic Semiconductor and Amelia Dalton explore the benefits of nRF54L series of ultra-low-power wireless SoCs. They examine the role that processing power plays in this solution, the details of the ultra-low-power 2.4 GHz radio included in these SoCs and how the Nordic Semiconductor Developer Academy can help you get your next BLE design up and running in no time.
Mar 24, 2025
27,856 views