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Infineon AIROC™ CYW20829 Bluetooth LE SoC ready with latest Bluetooth 5.4 specification

Munich, Germany – 23 March, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its AIROC™ CYW20829 Bluetooth® LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth Mesh networks, remote controls, human interface devices (mouse, keyboard, VR and gaming controllers), industrial automation, and automotive.

The recently released Bluetooth Core Specification 5.4 adds several significant capabilities to the existing specification, including PAwR (Periodic Advertising with Response), Encrypted Advertisement Data (EAD) and LE GATT Security Levels Characteristic. PAwR enables energy-efficient, bi-directional communication in a large-scale one-to-many or star topology. EAD provides a standardized approach to the secure broadcasting of data in advertising packets.

With PAwR, thousands of Bluetooth 5.4-enabled Electronic Shelf Labels (ESL) and sensors will have bidirectional communication with a single access point. Messages can contain commands, sensor data values, or other data, as defined by the application layer. EAD enables the encrypted data over-the-star network to be authenticated and decrypted only by devices that have shared the session key previously. Additionally, LE GATT Security Levels Characteristic enables devices to identify the security mode and level for all their GATT functionality. The combination of these features enable ultra-low power, efficient radio usage and secure star networks that can be deployed in large scale ESL and sensor applications.

“With Infineon’s AIROC CYW20829 Bluetooth LE SoC, our customers can achieve great RF performance, the latest Bluetooth features, built-in security, rich set of peripherals, and low power, all in one device,” said Shantanu Bhalerao, Vice President of the Bluetooth product line at Infineon. “This device will enable our customers to enjoy the full benefits of Bluetooth 5.4 and get products faster-to-market.”

Infineon’s AIROC CYW20829 device has best-in-class RF link budget with an integrated power amplifier providing 10 dBm of transmit output power and receive sensitivity of -98 dBm for LE 1Mbps and -106 dBm for LE Long Range 125 Kbps. CYW20829 is a dual-core Arm® M33 device where one M33 core is reserved as the Bluetooth controller, and the second Arm® Cortex-M33 is available for customer applications. The CPU subsystem provides 256 K RAM, XIP interface for external flash, and a rich set of peripherals including CAN to enable a diverse set of applications. Built-in security features include secure boot, secure execution environment, a TRNG, eFuse for custom keys and cryptography acceleration.

The AIROC CYW20829 is supported by the ModusToolbox™ development environment which enables developers to accelerate time-to-market for Bluetooth-enabled IoT solutions.

Availability

The AIROC CYW20829 Bluetooth LE SoC is currently sampling to select customers. More information on AIROC CYW20829 is available here.

About AIROC Wireless Connectivity Products

Infineon’s AIROC wireless products, including Wi-Fi®, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combos, have shipped more than a billion devices and are the go-to choice for IoT solutions. The broad portfolio includes high-performing, reliable, ultra-low-power products that deliver robust industry-leading performance.

AIROC products leverage a common software framework across Android, Linux, RTOS platforms and are pre-integrated with Infineon’s ModusToolbox software and tools, allowing developers to deliver high-quality, differentiated products to market on-time and on-budget.

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