industry news
Subscribe Now

Imec Unveils Cost-Effective Cooling Solution for High Performance Chips

3D-printed impingement cooling solution exceeds state-of-the-art air-cooled solutions

LEUVEN, May 29, 2018 — Imec, the world-leading research and innovation hub in nano-electronics and digital technology, today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.  This achievement is an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems.

High performance electronic systems are coping with increasing cooling demands. Conventional solutions realize cooling through combining heat exchangers that are bonded to heat spreaders that are then attached to the chip backside. These are all interconnected with thermal interface materials (TIM) that create a fixed thermal resistance that can’t be overcome by introducing more efficient cooling solutions. Direct cooling on the chip backside would be more efficient, but current direct cooling microchannel solutions create a temperature gradient across the chip surface.

The ideal chip cooler is an impingement-based cooler with distributed coolant outlets. It puts the cooling liquid in direct contact with the chip and sprays the liquid perpendicular to the chip surface. This ensures that all the liquid on the chip surface has the same temperature and reduces the contact time between coolant and chip. However, current impingement coolers have the drawback that they are silicon-based and thus expensive, or that their nozzle diameters and use processes are not compatible with the chip packaging process flow.

Imec has developed a new impingement chip cooler that uses polymers instead of silicon, to achieve a cost-effective fabrication. Moreover, imec’s solution features nozzles of only 300µm, made by high-resolution stereolithography 3D printing. The use of 3D printing allows customization of the nozzle pattern design to match the heat map and the fabrication of complex internal structures. Moreover, 3D printing allows to efficiently print the whole structure in one part, reducing production cost and time.

“Our new impingement chip cooler is actually a 3D printed ‘showerhead’ that sprays the cooling liquid directly onto the bare chip,” clarifies Herman Oprins, senior engineer at imec. “3D prototyping has improved in resolution, making it available for realizing microfluidic systems such as our chip cooler. 3D printing enables an application-specific design, instead of using a standard design.”

Imec’s impingement cooler achieves a high cooling efficiency, with a chip temperature increase of less than 15°C per 100W/cm2 for a coolant flow rate of 1 l/min. Moreover, it features a pressure drop as low as 0.3 bar, thanks to the smart internal cooler design. It outperforms benchmark conventional cooling solutions in which the thermal interface materials alone already cause a 20-50°C temperature increase. Next to its high efficiency and its cost-effective fabrication, imec’s cooling solution is much smaller compared to existing solutions, matching the footprint of the chip package enabling chip package reduction and more efficient cooling.

About imec

Imec is the world-leading research and innovation hub in nano-electronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, and energy.
As a trusted partner for companies, start-ups and universities we bring together close to 4,000 brilliant minds from over 85 nationalities. Imec is headquartered in Leuven, Belgium and also has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, China, and offices in India and Japan. In 2017, imec’s revenue (P&L) totaled 546 million euro. Further information on imec can be found at www.imec-int.com.

Leave a Reply

featured blogs
Dec 2, 2024
The Wi-SUN Smart City Living Lab Challenge names the winners with Farmer's Voice, a voice command app for agriculture use, taking first place. Read the blog....
Nov 22, 2024
I just saw a video on YouTube'”it's a few very funny minutes from a show by an engineer who transitioned into being a comedian...

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured paper

Quantized Neural Networks for FPGA Inference

Sponsored by Intel

Implementing a low precision network in FPGA hardware for efficient inferencing provides numerous advantages when it comes to meeting demanding specifications. The increased flexibility allows optimization of throughput, overall power consumption, resource usage, device size, TOPs/watt, and deterministic latency. These are important benefits where scaling and efficiency are inherent requirements of the application.

Click to read more

featured chalk talk

Dependable Power Distribution: Supporting Fail Operational and Highly Available Systems
Sponsored by Infineon
Megatrends in automotive designs have heavily influenced the requirements needed for vehicle architectures and power distribution systems. In this episode of Chalk Talk, Amelia Dalton and Robert Pizuti from Infineon investigate the trends and new use cases required for dependable power systems and how Infineon is advancing innovation in automotive designs with their EiceDRIVER and PROFET devices.
Dec 7, 2023
62,230 views