industry news
Subscribe Now

GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications

Sep 20, 2017

New 12LP technology offers density and performance improvement over current generation

Platform features enhancements for next-gen automotive electronics and RF/analog applications

Santa Clara, Calif., Sept. 20, 2017 – GLOBALFOUNDRIES today announced plans to introduce a new 12nm Leading-Performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density and a performance boost over GF’s current-generation 14nm FinFET offering, satisfying the processing needs of the most demanding compute-intensive applications from artificial intelligence and virtual reality to high-end smartphones and networking infrastructure.

The new 12LP technology provides as much as a 15 percent improvement in circuit density and more than a 10 percent improvement in performance over 16/14nm FinFET solutions on the market today. This positions 12LP to be fully competitive with other 12nm FinFET foundry offerings. The technology leverages GF’s expertise at Fab 8 in Saratoga County, N.Y., where its 14nm FinFET platform has been in high-volume production since early 2016.

“The world is in the midst of an unprecedented transition to an era of connected intelligence,” said GF CEO Sanjay Jha. “This new 12LP technology provides the performance and density improvements necessary to help our customers continue innovating at the system level, as they deliver real-time connectivity and edge processing to everything from high-end graphics and automobiles to industrial applications.”

“We are pleased to extend our longstanding relationship with GLOBALFOUNDRIES as a lead customer for their new 12LP technology,” said Mark Papermaster, CTO and senior vice president of technology and engineering, AMD. “Our deep collaboration with GF has helped AMD bring a set of leadership high-performance products to market in 2017 using 14nm FinFET technology. We plan to introduce new client and graphics products based on GF’s 12nm process technology in 2018 as a part of our focus on accelerating our product and technology momentum.”

In addition to transistor-level enhancements, the 12LP platform will include new market-focused features specifically designed for automotive electronics and RF/analog applications—two of the fastest-growing segments in the industry.

  • Emerging automotive applications in vehicle safety and automated driving require a combination of processing power and extreme reliability. The 12LP platform delivers both, with plans for Automotive Grade 2 qualification at Fab 8 by Q4 2017.
  • A new RF offering extends the 12LP platform for RF/analog applications such as premium-tier transceivers in sub-6GHz wireless networks. 12LP offers the best scaling in both logic and memory for RF chip architectures with primarily digital and less RF/analog content.

GF’s new 12nm FinFET technology complements its existing 12nm FD-SOI offering, 12FDXTM. While some applications require the unsurpassed performance of FinFET transistors, many connected devices need high levels of integration and more flexibility for performance and power consumption, at costs FinFET cannot achieve. 12FDX provides an alternative path for the next generation of connected intelligent systems, enabling the performance of 10nm FinFET with better power consumption, lower cost, and better RF integration than current-generation foundry FinFET offerings.

About GF:

GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit http://www.globalfoundries.com.

Leave a Reply

featured blogs
Mar 5, 2021
The combination of the figure and the moving sky in this diorama -- accompanied by the music -- is really rather tasty. Our cats and I could watch this for hours....
Mar 5, 2021
In February, we continued to build out the content on the website, released a new hierarchy for RF products, and added ways to find Samtec “Reserve” products. Here are the major web updates to Samtec.com for February 2021. Edge Card Content Page Samtec offers a fu...
Mar 5, 2021
Massive machine type communications (mMTC) along with enhanced Mobile Broadband (eMBB) and Ultra Reliable Low Latency Communications (URLLC) represent the three pillars of the 5G initiative defined... [[ Click on the title to access the full blog on the Cadence Community sit...
Mar 5, 2021
Explore what's next in automotive sensors, such as the roles of edge computing & sensor fusion and impact of sensor degradation & software lifecycle management. The post How Sensor Fusion Technology Is Driving Autonomous Cars appeared first on From Silicon To Softw...

featured paper

Increase the flexibility of your precision analog designs leveraging a low-cost MSP430™ MCU

Sponsored by Texas Instruments

There are many ways to address performance requirements while reducing the overall cost of your design. People often use dedicated integrated circuits to address specific functions, but this approach can cause variations in cost, complexity, and ease of use. There is another way to unlock the full potential of your design. Read more to see how a programmable MCU provides additional functionality and flexibility that is not typically available with conventional approaches.

Click here to read the paper

featured chalk talk

Minitek Microspace

Sponsored by Mouser Electronics and Amphenol ICC

With the incredible pace of automotive innovation these days, it’s important to choose the right connectors for the job. With everything from high-speed data to lighting, connectors have a huge impact on reliability, cost, and design. In this episode of Chalk Talk, Amelia Dalton chats with Glenn Heath from Amphenol ICC about the Minitek MicroSpace line of automotive- and industrial-grade connectors.

Click here for more information about Amphenol FCI Minitek MicroSpace™ Connector System