industry news
Subscribe Now

Enhanced Power Connector Series from Amphenol Features Low Profile, Capacity to Carry High Current

Technical Specifications
  • Can carry up to 150A at 500V DC
  • Offers wire terminations ranging from 6 AWG to 2 AWG
  • Uses proven RADSOK™ technology
Endicott, NY August 2022 – Amphenol Industrial Operations, a global leader in interconnect systems, has enhanced its Amphe-PD series with two low profile, two-way power connectors that have the capacity to carry high current. The Amphe-PD Mini 5.7mm and Gen2 5.7mm Amphe-PD can be used to transfer power from a PSU/PDU to a CPU, GPU PCB board.
The Amphe-PD Mini 5.7mm is designed to carry up to 120A at 500V DC. These connectors are available in busbar mount, right angle and vertical SMT compatible PCB mount.
The Gen2 5.7mm Amphe-PD can carry a maximum current of 150A at 500V DC. They come in black and red with a plastic housing and are available in vertical SMT compatible PCB mount.
Both connectors offer wire terminations ranging from 6 AWG to 2 AWG and can transfer power from a cable harness to PCB or other power application.
Both connectors in this enhanced power connector series feature a small footprint making them ideal for use in energy storage racks, data center equipment, servers, 5G, HPC and electrical devices where space is limited. They can accommodate reflow soldering or press fit termination onto the PCB.
These 5.7mm connectors feature RADSOK technology for higher amperage, lower t-rise, less resistance, and lower mating forces. This technology allows for more power in a smaller footprint.
The connectors also offer a mechanical latch feature that locks the connector in the mated position.
Both the Amphe-PD Mini 5.7mm and Gen2 5.7mm Amphe-PD are RoHS compliant and are available in UL-94 V0.

Leave a Reply

featured blogs
Nov 30, 2023
No one wants to waste unnecessary time in the model creation phase when using a modeling software. Rather than expect users to spend time trawling for published data and tediously model equipment items one by one from scratch, modeling software tends to include pre-configured...
Nov 27, 2023
See how we're harnessing generative AI throughout our suite of EDA tools with Synopsys.AI Copilot, the world's first GenAI capability for chip design.The post Meet Synopsys.ai Copilot, Industry's First GenAI Capability for Chip Design appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

TDK CLT32 power inductors for ADAS and AD power management

Sponsored by TDK

Review the top 3 FAQs (Frequently Asked Questions) regarding TDK’s CLT32 power inductors. Learn why these tiny power inductors address the most demanding reliability challenges of ADAS and AD power management.

Click here for more information

featured paper

Power and Performance Analysis of FIR Filters and FFTs on Intel Agilex® 7 FPGAs

Sponsored by Intel

Learn about the Future of Intel Programmable Solutions Group at intel.com/leap. The power and performance efficiency of digital signal processing (DSP) workloads play a significant role in the evolution of modern-day technology. Compare benchmarks of finite impulse response (FIR) filters and fast Fourier transform (FFT) designs on Intel Agilex® 7 FPGAs to publicly available results from AMD’s Versal* FPGAs and artificial intelligence engines.

Read more

featured chalk talk

Electromagnetic Compatibility (EMC) Gasket Design Considerations
Electromagnetic interference can cause a variety of costly issues and can be avoided with a robust EMI shielding solution. In this episode of Chalk Talk, Amelia Dalton chats with Sam Robinson from TE Connectivity about the role that EMC gaskets play in EMI shielding, how compression can affect EMI shielding, and how TE Connectivity can help you solve your EMI shielding needs in your next design.
Aug 30, 2023
11,237 views