industry news
Subscribe Now

Enclustra Mercury+™ XU1 SoC module: a true heavy hitter

The Xilinx® Zynq® UltraScale+™ SoC module under any circumstances

Zurich, 19th January 2018 – With the Mercury+ XU1, Enclustra presents at Embedded World 2018 in Nuremberg at booth 3-210 its fastest SoC module based on the Xilinx Zynq UltraScale+ MPSoC. It accommodates 6 ARM cores, a Mali 400MP2 GPU, up to 4 GB of extremely fast DDR4 ECC SDRAM, numerous standard interfaces, 294 user I/Os and up to 747,000 LUT4 equivalents – all on an area smaller than a credit card.

With the Mercury+ XU1, FPGA specialists Enclustra offer a quick and easy way into the Xilinx Zynq UltraScale+ MPSoC ecosystem. In addition to up to 747,000 systems logic cells across 6 ARM processors, the Mercury+ XU1 also possesses a GPU and up to 294 user I/Os. Built-in interfaces include two Gigabit Ethernet, USB 3.0 and USB 2.0, sixteen MGTs (with speeds of up to 12.5 Gbps), as well as PCIe Gen2 x4. With up to 4 GB of DDR4 SDRAM with bandwidths of 19.2 GByte/s and ECC, as well as 16 GB eMMC flash memory, the Mercury+ XU1 is supremely equipped to handle even the heaviest of resource-hogging applications, despite having a footprint of just 74 × 54 mm.

The module is available in both commercial and industrial temperature ranges, and needs just a single 5-15 V supply for operation.

Reference design and Linux at the push of a button

Enclustra offers a broad design-in support for their products. With the Mercury+ PE1-300 or Mercury+ PE1-400 baseboards, the Mercury+ XU1 can be a powerful development and prototyping platform.

Further expansion options are provided by the LPC/HPC FMC connectors on the PE1 base board, compatible with a huge range of plug-in cards from various manufacturers – ADCs, DACs, motor control cards and RF links are just a small selection of possibilities.

Enclustra also offers a comprehensive ecosystem for the XU1, offering all required hardware, software and support materials. The Mercury+ PE1 base board is a complete development platform; detailed documentation and reference designs make it easy to get started, in addition to the user manual, schema, a 3D-model, PCB footprint and differential I/O length tables.

The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and base board are selected by a graphical interface. After that, Enclustra Build Environment downloads the appropriate Bitstream, First Stage Boot Loader (FSBL) and the required source code. Finally, U-Boot, Linux and the root file system based on BusyBox are compiled.

Thanks to the family concept with compatible connectors, different types of modules can be used on the same base board. If for example, an ARM processor is not required, the Mercury+ KX2 FPGA module can be used on the same baseboard instead.

About Enclustra GmbH

Enclustra is an innovative and successful Swiss FPGA design company. With the FPGA Design Center, Enclustra provides services covering the whole range of FPGA-based system development: From high-speed hardware or HDL firmware through to embedded software, from specification and implementation through to prototype production. In the FPGA Solution Center, Enclustra develops and markets highly-integrated FPGA modules and FPGA-optimized IP cores. By specializing in forward-looking FPGA technology, and with broad application knowledge, Enclustra can offer ideal solutions at minimal expense in many areas. More information can be found at: www.enclustra.com

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Advantech Industrial AI Camera: Small but Mighty
Sponsored by Mouser Electronics and Advantech
Artificial intelligence equipped camera systems can be a great addition to a variety of industrial designs. In this episode of Chalk Talk, Amelia Dalton and Ryan Chan from Advantech explore the components included in an industrial AI camera system, the benefits of Advantech’s AI ICAM-500 Industrial camera series and how you can get started using these solutions in your next industrial design. 
Aug 23, 2023
29,355 views