Louisville, CO – August 23, 2017 – Short workshops have been added to the 2018 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative. The new 90-minute workshops will be offered alongside sponsored 3.5 hour tutorials on Thursday, March 1. DVCon U.S. is currently accepting proposals for the workshops and tutorials through September 29, 2017 for its conference to be held February 26-March 1, 2018 at the DoubleTree Hotel in San Jose, California.
“We strive to evolve DVCon U.S. to meet the growing needs of industry as technology advances,” commented Dennis Brophy, DVCon U.S. 2018 General Chair. “We have found that short topic workshops encourage smaller companies to participate more deeply in our four-day technical program. The shorter workshops open up options for more sponsors to present current, in-depth technical content and expand audience appeal. With both tutorials and workshops spread throughout the final day of the conference, our attendees will have more choices to maximize their learning opportunities.”
DVCon U.S. is looking for short workshop topics and tutorials that are current, have a high-level of interest and offer strong continuing educational content. Proposals should be a brief abstract, two to five paragraphs in length, and 1,000 words maximum. For more information on suggested topics for the short workshops and to submit a proposal, visit here. For more information on the tutorials and to submit a proposal, visit here.
About DVCon
DVCon is the premier conference on the application of languages, tools and methodologies for the design and verification of electronic systems and integrated circuits. DVCon is sponsored by Accellera Systems Initiative, an industry consortium dedicated to the development and standardization of design and verification languages. DVCon currently has five conferences around the globe: DVCon China, DVCon Europe, DVCon India, DVCon Japan and DVCon U.S. Follow @dvcon on Twitter or to comment, please use #dvcon.
