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Coventor Adds Process Optimization Features to SEMulator3D 8.0

New Features Enable SEMulator3D 8.0 to Address Both Process Modeling and Device Analysis for Better Insight into Advanced Semiconductor Technology Development

Fremont, CA—JULY 8, 2019 – Coventor, a Lam Research Company, the leading supplier of process modeling and simulation for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 8.0 – the newest version of its semiconductor virtual fabrication platform. With added features, performance improvements, and a new Process Window Optimization capability, SEMulator3D 8.0 addresses both process and device simulation while lowering the barriers to advanced semiconductor technology development. The new Process Window Optimization (PWO) feature performs process window optimization without the requirement for time-consuming and expensive silicon wafer tests. This capability, in conjunction with existing SEMulator3D features, enables earlier understanding of critical process factors and their impact on yield.

“With each release of SEMulator3D, we are providing more and more powerful analytics capabilities,” said David Fried, Vice President, Computational Products for Lam Research. “The new Process Window Optimization feature set, combined with our previously-released Analytics module, make SEMulator3D the most advanced solution for advanced process modeling. Our customers can now establish optimal process settings and process windows early in technology development and accelerate their time to market.”

SEMulator3D 8.0 Productivity Enhancements 

The new version of SEMulator3D 8.0, which is available now, includes many additional features and performance enhancements such as:

 

  • Process Window Optimization

 

The new Process Window Optimization workflow can be used to understand and identify the ranges of input parameters (i.e. the process window) needed to achieve user-defined performance goals and optimize product yield.  (more)

 

  • New Electrical Analysis Functionality

 

A new ‘Validate Netlist’ feature is available to validate and merge extracted netlist files with reference CDL (circuit design language) netlists obtained from 3rd-party electronic design automation (EDA) tools. In addition, the resistance and capacitance solvers in Electrical Analysis are now substantially faster (up to 40X) compared to previous versions of SEMulator3D 

  • Transistor Modeling Enhancements

Small signal AC analysis is currently available, to accurately extract device capacitance and explore transistor process variability on device performance. A new variety of physical phenomena, such as field-dependent recombination and band-to-band tunneling, are now supported in the device solver.

 

  • Additional Process Modeling Features

 

A new Monte Carlo implant step provides a more realistic ion implantation model, through advanced simulation of the ion implantation profile.

 

  • Custom Process Flows

 

A new feature to import custom process flows and create SEMulator3D input files has been added, to support site-specific process flows 

SEMulator3D Version 8.0 will be installed and deployed at all major semiconductor customers in the US, Europe, Taiwan, Japan, Korea and China. 

About Coventor

Coventor, Inc., a Lam Research Company, is the global market leader in virtual fabrication of semiconductor and MEMS devices and design automation solutions for microelectromechanical systems (MEMS). The company serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and research and development organizations. Its SEMulator3D modeling and analysis platform is used for fast and accurate virtual fabrication of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Coventor’s unique and powerful platform for MEMS design, simulation, and verification addresses MEMS-specific engineering challenges such as multi-physics interactions, process variations, MEMS+IC integration, and MEMS+package interactions. More information is available at www.coventor.com

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