industry news
Subscribe Now

congatec teams up with OSADL to optimize the support for Real-Time Linux

Smooth implementation of hard real-time
San Diego, CA, USA, June 21, 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – teams up with OSADL, Open Source Automation Development Lab eG, to optimize the board support for Real-Time Linux and showcase it in the OSADL test racks. In a first step, OSADL qualified congatec’s latest real-time Linux implementation that uses Linux kernel 4.9.47-rt37 on conga-TS170 Server-on-Modules equipped with the embedded server-class Intel® Xeon® processor (E3-1578L v5 @ 2.00 GHz). The COM Express Type 6 module mounted on the evaluation carrier board conga-TEVAL performed well in the tests, impressing in particular through one of the best-in-class real-time capabilities.
The challenge when implementing hard real-time Linux behavior lies in mastering all processing layers from BIOS to Linux kernel to user space, since the overall real-time capabilities are only as good as the weakest link in the chain. In addition, modern processors such as Intel’s Skylake family offer a wide range of energy saving features that must be balanced to the requirements of real-time computing. Executed in standardized racks, the OSADL quality assurance testifies that conga-TS170 Server-on-Modules are perfect for any real-time application. Target markets for these high-end modules for workstations and servers that also provide high-end graphics include high-speed test and measurement equipment, back-end systems in medical imaging, high-performance industrial workstations as well vision-based inspection systems and situational awareness platforms.
“The congatec module with the Intel Xeon E3 processor of the Skylake generation passed all tests and showed excellent response times,” sums up Dr. Carsten Emde, General Manager of OSADL eG. “We at OSADL are very pleased that congatec has joined our organization. congatec and OSADL fit together very well; our customers and members come from virtually the same industries and therefore benefit equally from our services. One of these services is the OSADL QA farm, where embedded systems with very high test depths are tested for their real-time capability and other features important for industry.”
“Teaming up with OSADL is a great advantage for both our customers and our own engineering team, as we all benefit from the joint forces for our real-time Linux developments. OSADL membership provides a vendor independent testimonial of our high-quality engineering and we receive great support with licensing questions as well. Joint engineering projects for new open source solutions also help us to concentrate on our own core competences – offering competitive advantages for our customers by simplifying the use of embedded computer technology”, explains Carsten Rebmann, Director R&D at congatec.
Linux and real-time Linux implementations dominate in embedded system designs, with 58% of all new projects expected to start with Open Source (OS) and nearly the same amount of projects (59%) involving real-time[i], as the latest surveys indicate[ii]. Because of this outstanding importance of real-time computing, congatec products support all major real-time capable OS from both x86 and ARM technologies. These include first and foremost real-time Linux but also further RTOS such as VxWorks or QNX, as well as deterministic hypervisor and virtualization technologies from vendors such as Real-Time Systems. congatec’s membership in the OSADL foundation rounds off this engagement. More information about the performance of the conga-TS170 Server-on-Module can be found at OSADL QA Farm rack no. 5, slot no.3 (https://www.osadl.org/?id=1305).
For more information about the conga-TS170 Server-on-Module please visit the product page http://www.congatec.com/en/products/com-express-type6/conga-ts170.html
About congatec 
congatec is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and customizing services. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, entertainment, transportation, telecommunication, test & measurement and point-of-sale. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. Headquartered in Deggendorf, Germany, congatec currently has entities in USA, Taiwan, China, Japan and Australia as well as United Kingdom, France, and the Czech Republic. More information is available on our website at www.congatec.com or via FacebookTwitter and YouTube.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Miniaturization Impact on Automotive Products
Sponsored by Mouser Electronics and Molex
In this episode of Chalk Talk, Amelia Dalton and Kirk Ulery from Molex explore the role that miniaturization plays in automotive design innovation. They examine the transformational trends that are leading to smaller and smaller components in automotive designs and how the right connector can make all the difference in your next automotive design.
Sep 25, 2023
26,308 views