industry news
Subscribe Now

congatec COM Express Computer-on-Modules with brand new 8th Gen Intel® Xeon® and Intel® Core™ processors (Coffee Lake H)

Powerful congatec six-pack for Type 6
San Diego, CA, USA, April 3, 2018  * * *  congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces its brand new conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel® Xeon® and Intel® Core™ processors (codename Coffee Lake H). They propel the 35-45 W TDP class of COM Express Type 6 modules to a new ‘six-pack’ level of high-end embedded computing, offering for the first time up to 6 cores, 12 threads and an impressive turbo boost of up to 4.4 GHz and drive up to three independent 4k UHD displays. Initial tests from congatec indicate that these brand new six-core modules offer between 45 to 50 percent more multi-thread and 15 to 25 percent more single-thread performance, compared to 7th Gen Intel® Core™ processor based variants. At a given TPD, system designs achieve higher bandwidth at overall lower power consumption ultimately leading to higher system efficiency. Target applications are high performance embedded and mobile systems, industrial and medical workstations, storage servers and cloud workstations, as well as media transcoding and edge computing cores.
“Markets such as medical imaging and Industry 4.0 as well as video analytics for e.g. situational awareness and transportation observation are keen on any new performance improvement,” explains Martin Danzer, Director of Product Management at congatec. “We simplify the use of these performance improvements with our standardized Computer-on-Modules, cooling solutions and eAPIs, making upgrading to the latest processor generations more or less a plug & play task.”
Beside performance gains, the new congatec modules impress with extended long-term availability of 10 years plus, high bandwidth I/Os with 4x USB 3.1 Gen 2 (10 Gbit/s) and Intel® Optane™ memory support, as well as enhanced security features including Intel®Software Guard extensions, Trusted Execution Engine and Intel® Platform Trust Technology.
The feature set in detail
The new conga-TS370 COM Express Basic Type 6 Computer-on-Modules are available with six-core Intel® Xeon® and Intel® Core™ i7 processors, or quad core Intel® Core™ i5 processors in a 35 to 45 W cTDP envelope and up to 32 GB DDR4 2666 memory with ECC option. The integrated Intel® UHD630 graphics supports up to three independent 4k displays with up to 60Hz via DP 1.4 , HDMI, eDP and LVDS. For the first time, designers can switch now from eDP to LVDS purely by software without any hardware change. The modules excel with high bandwidth I/Os including 4x USB 3.1 Gen 2 (10 Gbit/s), 8x USB 2.0 and 1x PEG and 8 PCIe Gen 3.0 lanes for powerful system extensions including Intel® Optane™ memory. All common Linux operating systems as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT are executable. A premium class personal integration support in combination with an extensive range of accessories as well as standardized or customized carrier boards and systems complete the new modules’ service package.
The new conga-TS370 COM Express Type 6 Computer-on-Modules can be ordered in the following standard configurations:
Processor
Cores/
Threads
Clock [GHz] (Base/Boost)
Cache (MB)
TDP / cTDP [W]
Intel® Xeon®
E-2176M
6 / 12
2.7 / 4.4
12
45 / 35
Intel® Core™ i7-8850H
6 / 12
2.6 / 4.3
9
45 / 35
Intel® Core™ i5-8400H
4 / 8
2.5 / 4.2
8
45 / 35
More information about the new conga-TS370 high-performance COM Express Type 6 Computer-on-Modules is available at: http://www.congatec.com/en/products/com-express-type6/conga-ts370.html
About congatec 
congatec is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and customizing services. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, entertainment, transportation, telecommunication, test & measurement and point-of-sale. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. Headquartered in Deggendorf, Germany, congatec currently has entities in USA, Taiwan, China, Japan and Australia as well as United Kingdom, France, and the Czech Republic. More information is available on our website at www.congatec.com or via FacebookTwitter and YouTube.

Leave a Reply

featured blogs
Apr 19, 2024
Data type conversion is a crucial aspect of programming that helps you handle data across different data types seamlessly. The SKILL language supports several data types, including integer and floating-point numbers, character strings, arrays, and a highly flexible linked lis...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
Apr 18, 2024
See how Cisco accelerates library characterization and chip design with our cloud EDA tools, scaling access to SoC validation solutions and compute services.The post Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Audio Design for Augmented and Virtual Reality (AR/VR) Glasses
Open ear audio can be beneficial to a host of different applications including virtual reality headsets, smart glasses, and sports and fitness designs. In this episode of Chalk Talk, Amelia Dalton and Ryan Boyle from Analog Devices explore the what, where, and how of open ear audio. We also investigate the solutions that Analog Devices has for open ear audio applications and how you can design open ear audio into your next application. 
Jan 23, 2024
11,997 views