industry news
Subscribe Now

Complete Ultra-High-Power-Density Charger Solution from Diodes Incorporated Delivers Improved Efficiency and Reduced Size

Plano, Texas – November 2, 2021 – Diodes Incorporated (Nasdaq: DIOD) has launched a three-chip solution for enhancing the performance of ultra-high-power-density USB Type-C® power delivery (PD) systems. These products can be used in a wide variety of consumer electronics applications, including smartphone chargers and notebook adapters.

The AP43771V USB Type-C PD decoder is compatible with PD3.0, PPS Rev 3.0, V1.2 (TID – 4305), and Qualcomm® Quick Charge™ QC4/QC4+/QC5 (QC20201127203) protocols. It supports a 3.3V to 24V operating voltage range and incorporates both a one-time programmable (OTP) ROM for all the main firmware, and a multi-time programmable (MTP) ROM to accommodate user configuration data.

With I2C and GPIO pins and built-in application firmware, the AP43771V backs various intelligent power management systems during charging states. These include smart power sharing among multiple charging ports, thermal power de-rating, LED light indication, and fault indication.

The AP3306 is an active clamp flyback (ACF) controller that reaches elevated operational efficiency via zero voltage switching (ZVS) and magnetic energy recycling. It can be used with an integrated driver GaN FET, a Cascode GaN FET, or a MOSFET serving as the main low-side switch. With integrated high-side ACF gate driver control, the AP3306 supports leakage energy recycling circuitry via a reduced-current-capability high-side MOS switch. This high degree of integration and use of cost-effective components reduces bill-of-material (BOM) costs and board space.

The APR340 is a secondary-side synchronous rectification (SR) MOSFET driver optimized for use with the AP3306. It features a built-in pulse linear regulator and operates in constant current (CC) mode to safeguard the charging system. The system output voltage can go as low as 2V, which is a significant benefit in programmable power supply (PPS) applications.

The AP43771V is available in both W-DFN3030-14 and W-QFN4040-24 package options. The AP3306 is supplied in a SO-10 package format, while the APR340 comes in a SOT26 package. These devices are respectively priced at $0.49 (AP43771V, W-DFN3030-14), $0.52 (AP43771V, W-QFN4040-24), $0.41 (AP3306), and $0.14 (APR340) each in 1000 piece quantities.

About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. We leverage our expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Our broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 31 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets. For more information visit www.Diodes.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Reliable Connections for Rugged Handling
Sponsored by Mouser Electronics and Amphenol
Materials handling is a growing market for electronic designs. In this episode of Chalk Talk, Amelia Dalton and Jordan Grupe from Amphenol Industrial explore the variety of connectivity solutions that Amphenol Industrial offers for materials handling designs. They also examine the DIN charging solutions that Amphenol Industrial offers and the specific applications where these connectors can be a great fit.
Dec 5, 2023
18,829 views