industry news
Subscribe Now

Compact and Powerful: The New DS6001 Processor Board

  • dSPACE further extends the SCALEXIO product line
  • Integrated processor board for SCALEXIO LabBox
  • Powerful quad-core Intel® Core™ i7 processor
  • High-performance I/O connection via high-bandwidth IOCNET

Wixom, Michigan, January 31, 2018: The versatile dSPACE SCALEXIO product line has recently been extended with the DS6001 Processor Board. It uniquely combines high computation power and comprehensive real-time performance with the most compact design for processor hardware in the SCALEXIO product line. Integrating the DS6001 in the SCALEXIO LabBox chassis results in a complete desktop system that lets you develop functions (rapid control prototyping, RCP) or perform hardware-in-the-loop testing (HIL) directly at the developer´s workstation. 

Powerful Quad-Core Intel® i7 Processor

The DS6001 is equipped with a quad-core Intel Core i7-6820EQ processor. Its high processing power as well as minimized jitter and latencies lead to an excellent real-time performance. Thus, the DS6001 is particularly suitable for real-time applications with fast control loops and high I/O bandwidths such as electric drives, vibration control, and data acquisition. Moreover, it is possible to distribute the different computation tasks to individual processor cores and to join multiple DS6001 Processor Boards to form a multiprocessor system. Subsequently, processing power and I/O capabilities can be significantly increased for real-time applications even beyond the scope of the individual processor board.

High-Performance I/O Connection via High-Bandwidth IOCNET

The DS6001 Processor Boards and SCALEXIO I/O hardware are interconnected via the dSPACE IOCNET network technology. The latter is specifically designed to provide large I/O bandwidth with low latency and jitter, even for more complex setups with high requirements. Moreover, the DS6001 provides an integrated Ethernet I/O interface for direct TCP/IP or UDP/IP access from the real-time model. This way, ECUs can be efficiently connected to the SCALEXIO system in bypassing scenarios, for example.

About SCALEXIO:

SCALEXIO is a modular real-time system used for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) testing. In these areas, SCALEXIO offers precise and fast real-time computation of large and complex models. Aside from the large number of I/O functionalities, SCALEXIO also supports various bus and network systems, such as CAN, CAN FD, LIN, FlexRay, and Ethernet. The I/O channels are specified with the central configuration software ConfigurationDesk. dSPACE IOCNET technology makes it easy to extend and set up decentralized systems. SCALEXIO can also be connected to existing dSPACE real-time systems.

For more information, see www.dspace.de/go/scalexio

About dSPACE:

dSPACE develops and distributes integrated hardware and software tools for developing and testing electronic control units and mechatronic controls. The application areas for dSPACE systems are primarily in the automotive industry, but also in drives technology, aerospace, and other industrial sectors. The company’s customer base includes virtually all major vehicle manufacturers and suppliers. With more than 1,400 employees worldwide, dSPACE is located in Paderborn, Germany; has three project centers in Germany; and serves customers through local dSPACE companies in the USA, the UK, France, Japan, and China.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
26,092 views