industry news
Subscribe Now

CEVA Locates More Success with Bluetooth® 5.1 IP

Company announces availability of RivieraWaves Bluetooth 5.1 IP; multiple license agreements already signed with leading semiconductor companies

MOUNTAIN VIEW, Calif., – January 29, 2019 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced the general release of its RivieraWaves Bluetooth 5.1 IP. Supporting the headline new feature of Direction Finding via Angle of Arrival (AoA) and Angle of Departure (AoD) for enhanced location services, the RW-Bluetooth 5.1 IP is available in both Bluetooth Dual Mode and Bluetooth Low Energy flavors.

Henrique Rocha, Research Analyst, ABI Research, remarked: “The potential for Real-Time Locating Systems (RTLS) and Indoor Positioning Systems (IPS) is huge across many markets including smart manufacturing, healthcare, proximity services in retail, wayfinding in airports, shopping malls, and hotels. With the ratification of direction finding using AoA and AoD as part of the Bluetooth 5.1 standard, Bluetooth offers an improved location service solution with unprecedented centimeter-level accuracy. As this industry scales, Bluetooth, with its very cost and power-efficient nature, backed with guaranteed interoperability, is set to become a technology of choice for RTLS & IPS. Companies like CEVA that support this latest Bluetooth standard are an important contributor to the proliferation of this technology.”

Aviv Malinovitch, vice president and general manager of CEVA’s Connectivity business unit, stated: “We congratulate the Bluetooth SIG on the release of the Bluetooth 5.1 specification. We see a strong interest from our customer base in accurate indoor positioning and asset tracking, and have already signed multiple license agreements for our latest Bluetooth 5.1 IP. We are proud to help our customers to rapidly enhance their Bluetooth-enabled products with this capability.”

“The Bluetooth community continues to find ways to meet evolving market needs and open new opportunities,” said Mark Powell, Bluetooth SIG executive director. “The addition of Bluetooth direction finding demonstrates this commitment to drive innovation and support the incredible growth opportunity within the location services market.”

About RivieraWaves Bluetooth 
CEVA’s RivieraWaves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth LE and Bluetooth dual mode connectivity. Each platform consists of a hardware baseband controller, plus a feature-rich software protocol stack. A flexible radio interface allows the platforms to be deployed with either RivieraWaves RF or various partners’ RF IP, enabling optimal selection of foundry and process node. All Bluetooth 5.1 features are supported, including LE 2Mbps data rate, Long Range, LE Advertising Extension and AoA/AoD. With more than 1.5 billion devices shipped to date and dozens of licensees, the RivieraWaves Bluetooth IP is widely deployed in consumer and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables. For more information on RivieraWaves Bluetooth IP platforms, go to https://www.ceva-dsp.com/product/rivierawaves-bluetooth-platforms/.

About CEVA, Inc.
CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT (NB-IoT and Cat-M1) enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4×4). Visit us at www.ceva-dsp.com and follow us on TwitterYouTube FacebookLinkedIn and Instagram.

Leave a Reply

featured blogs
Apr 16, 2024
In today's semiconductor era, every minute, you always look for the opportunity to enhance your skills and learning growth and want to keep up to date with the technology. This could mean you would also like to get hold of the small concepts behind the complex chip desig...
Apr 11, 2024
See how Achronix used our physical verification tools to accelerate the SoC design and verification flow, boosting chip design productivity w/ cloud-based EDA.The post Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud appeared ...
Mar 30, 2024
Join me on a brief stream-of-consciousness tour to see what it's like to live inside (what I laughingly call) my mind...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
16,365 views