industry news
Subscribe Now

CEVA Announces DSP and Voice Neural Networks Integration with TensorFlow Lite for Microcontrollers

  • WhisPro™ speech recognition software for voice wake words and custom command models now available with open source TensorFlow Lite for Microcontrollers implementing machine learning at the edge
  • • TensorFlow Lite for Microcontrollers from Google is already optimized and available for CEVA-BX DSP cores, accelerating the use of low power AI in conversational and contextual awareness applications
MOUNTAIN VIEW, Calif., – March 24, 2020 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its CEVA-BX DSP cores and WhisPro™ speech recognition software targeting conversational AI and contextual awareness applications now also support TensorFlow Lite for Microcontrollers, a production ready, cross-platform framework for deploying tiny machine learning on power-efficient processors in edge devices. Tiny machine learning brings the power of AI to extremely low power, always-on, battery operated IoT devices for on-device sensor data analytics in areas such as audio, voice, image and motion. CEVA’s holistic approach to AI at the edge ensures that customers using TensorFlow Lite for Microcontrollers can utilize a unified processor architecture to run both the framework and the associated neural network workloads required to build these intelligent connected products. CEVA’s WhisPro speech recognition software and custom command models are integrated with the TensorFlow Lite framework, further accelerating the development of small footprint voice assistants and other voice controlled IoT devices.
Pete Warden, Technical Lead of TensorFlow at Google commented: “CEVA has been at the forefront of machine learning and neural networks inferencing for embedded systems and understands that the future of ML is Tiny going into extremely power and cost constrained devices. Their continued investment into powerful architectures, tools and software which support TensorFlow models provide a compelling offering for a new generation of intelligent embedded devices to harness the power of AI.”
Erez Bar-Niv, Chief Technology Officer at CEVA, stated: “The increasing demand for on-device AI to augment contextual awareness and conversational AI workloads poses new challenges to the cost, performance and power efficiency of intelligent devices. TensorFlow Lite for Microcontrollers dramatically simplifies the development of these devices, by providing a lean framework to deploy machine learning models on resource-constrained processors. With full optimization of this framework for our CEVA-BX DSPs and our WhisPro speech recognition models, we are lowering the entry barrier for SoC companies and OEMs to add intelligent sensing to their devices.”
The CEVA-BX DSP family is a high-level programmable hybrid DSP/controller offering high efficiency for a broad range of signal processing and control workloads of real-time applications. Using an 11-stage pipeline and 5-way VLIW micro-architecture, it offers parallel processing with dual scalar compute engines, load/store and program control that reaches a CoreMark per MHz score of 5.5, making is suitable for real time signal control. Its support for SIMD instructions makes it ideal for a wide variety of signal processing applications and the double precision floating point units efficiently handle contextual awareness and sensor fusion algorithms with a wide dynamic range. It facilitates simultaneous processing of front-end voice, sensor fusion, audio processing, and general DSP workloads in addition to AI runtime inferencing. This also allows customers and algorithm developers to take advantage of CEVA’s extensive audio, voice and speech machine learning software and libraries to accelerate their product designs. For more information, visit https://www.ceva-dsp.com/product/ceva-bx2-sound/.
About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT. Our ultra-low-power IPs include comprehensive DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and IMU solutions for AR/VR, robotics, remote controls, and IoT. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For wireless IoT, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT. Visit us at www.ceva-dsp.com and follow us on TwitterYouTube, FacebookLinkedIn and Instagram.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Nexperia Energy Harvesting Solutions
Sponsored by Mouser Electronics and Nexperia
Energy harvesting is a great way to ensure a sustainable future of electronics by eliminating batteries and e-waste. In this episode of Chalk Talk, Amelia Dalton and Rodrigo Mesquita from Nexperia explore the process of designing in energy harvesting and why Nexperia’s inductor-less PMICs are an energy harvesting game changer for wearable technology, sensor-based applications, and more!
May 9, 2023
40,594 views