industry news
Subscribe Now

Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design

Announcement marks Cadence’s expansion into fast-growing system analysis and design market

Highlights:
•       The first product in Cadence’s system analysis initiative, the Clarity 3D Solver delivers up to 10X faster performance for electromagnetic simulation with virtually unlimited capacity and gold-standard accuracy
•       New breakthrough architecture can run on hundreds of CPUs optimized for both cloud and on-premises distributed computing
•       True 3D model extraction eliminates risk from manually reducing the size of structures being modeled
•       Easily reads design data from all standard chip and IC package platforms and offers unique integration with Cadence implementation platforms

SAN JOSE, Calif., April 2, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today entered the fast-growing system analysis and design market with the announcement of the Cadence® Clarity™ 3D Solver, which delivers gold-standard accuracy with up to 10X faster simulation performance and unbounded capacity compared to legacy field solver technology. Harnessing state-of-the-art distributed multiprocessing technology, the Clarity 3D Solver efficiently tackles electromagnetic (EM) challenges encountered when designing complex 3D structures on chips, packages, PCBs, connectors and cables—bringing true 3D analysis to any engineer with desktop, high-performance computing (HPC) or cloud computing resources. The Clarity 3D Solver easily reads design data from all standard chip, IC package and PCB implementation platforms while also providing unique integration benefits for design teams using the Cadence Allegro® and Virtuoso® implementation platforms. For more information, please visit http://www.cadence.com/go/3dsolver.

Highly complex structures found in silicon interposers, rigid-flex PCBs and stacked-die IC packages must be modeled accurately in 3D for structure optimization and high-speed signaling compliance. High-speed signaling, such as in 112G serializer/deserializer (SerDes) interfaces, relies on high-fidelity interconnect design. Any slight change in impedance can negatively impact bit error rate, so optimization entails extensive research including dozens of complex extractions and simulations. To accommodate this workload, legacy field solvers must run on massive, expensive high-performance servers. In addition, speed and capacity limitations of legacy field solver technology require users to carefully simplify and/or partition the structure into smaller segments to fit within local computing constraints. This pseudo-3D approach creates the risk that the resulting final model may contain inaccuracies due to artificial effects from the superficial model boundaries.

Clarity 3D Solver technology addresses the most complex EM challenges faced when designing systems for 5G communications, automotive/ADAS, HPC and IoT applications. Industry-leading Cadence distributed multiprocessing technology enables the Clarity 3D Solver to deliver virtually unlimited capacity and a 10X speed up required to efficiently and effectively address these larger and more complex structures. The Clarity 3D Solver creates highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analysis, enabling simulation results that match lab measurement.

The Clarity 3D Solver is optimized to distribute a job across multiple low-cost computers while remaining equally efficient when running on a more powerful and expensive server with terabytes of memory. A unique distributed adaptive meshing approach and significantly smaller memory requirements than legacy 3D field solvers enable the Clarity 3D Solver to extensively utilize cost-effective cloud and on-premises distributed computing. These advantages make the cloud-ready Clarity 3D Solver an ideal choice to optimize a company’s cloud computing budget.

Using the Clarity 3D Solver in conjunction with the Cadence Sigrity™ 3D Workbench, users can merge mechanical structures such as cables and connectors with their system design and model the electrical-mechanical interconnect as a single model. The Clarity 3D Solver is also tightly integrated with the Virtuoso, Cadence SiP Layout and Allegro implementation platforms, enabling 3D structures to be designed in the Allegro and Virtuoso environments, optimized in the analysis tool and implemented in the design tool without being redrawn.

“At gigabit speeds on our highly dense PCBs with over 30 layers, we depend on accurate interconnect extraction of our complex structures to support signal integrity analysis,” said Rick Burns, vice president of engineering, Semiconductor Test Division at Teradyne. “With the Cadence Clarity 3D Solver, we can achieve the necessary accuracy in a fraction of the time it has previously taken. This has opened up a new era of analysis possibilities for us since we can now run dozens of simulations in the time it has previously taken to run one. This reduces design re-spins and helps us fulfill our promise of delivering the highest throughput and lowest cost of test for our customers.”

“As we move into the era of More than Moore, multi-physics simulations are becoming increasingly important to our future chip and system designs,” said Catherine Xia, senior director of platform technology at HiSilicon. “Legacy 3D field solver technology has been incapable of meeting our requirements for simulating the entire system, including chip, package, PCB and enclosure. We are very excited to see the breakthrough performance and capacity introduced by the Cadence Clarity 3D Solver, and we look forward to more system-level simulation innovations from Cadence.”

“Our newly formed System Analysis Group is breaking new ground on next-generation algorithms to solve the most difficult electromagnetic challenges across ICs, packages, boards and complete systems,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “This first major technology breakthrough, the Clarity 3D Solver, expands Cadence’s product portfolio beyond traditional EDA—furthering our System Design Enablement strategy and enabling us to expand our system portfolio and market opportunities. With the Clarity 3D Solver, semiconductor and systems companies can address system-level problems for a broad spectrum of today’s most challenging applications including 112G communication networks, IoT, automotive/ADAS, and other complex high-speed electronic systems.”

About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products – from chips to boards to systems – in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of FORTUNE Magazine’s 100 Best Companies to Work For. Learn more at cadence.com. ( https://www.cadence.com/ )

Leave a Reply

featured blogs
Sep 25, 2020
What do you think about earphone-style electroencephalography sensors that would allow your boss to monitor your brainwaves and collect your brain data while you are at work?...
Sep 25, 2020
Weird weather is one the things making 2020 memorable. As I look my home office window (WFH – yet another 2020 “thing”!), it feels like mid-summer in late September. In some places like Key West or Palm Springs, that is normal. In Pennsylvania, it is not. My...
Sep 25, 2020
[From the last episode: We looked at different ways of accessing a single bit in a memory, including the use of multiplexors.] Today we'€™re going to look more specifically at memory cells '€“ these things we'€™ve been calling bit cells. We mentioned that there are many...
Sep 25, 2020
Normally, in May, I'd have been off to Unterschleißheim, a suburb of Munich where historically we've held what used to be called CDNLive EMEA. We renamed this CadenceLIVE Europe and... [[ Click on the title to access the full blog on the Cadence Community site...

Featured Video

Product Update: Synopsys and SK hynix Discuss HBM2E at 3.6Gbps

Sponsored by Synopsys

In this video interview hear from Keith Kim, Team Leader of DRAM Technical Marketing at SK hynix, discussing the wide adoption of HBM2E at 3.6Gbps and successful collaboration with Synopsys to validate the DesignWare HBM2E IP at the maximum speed.

Click here for more information about DesignWare DDR IP Solutions

Featured Paper

The Cryptography Handbook

Sponsored by Maxim Integrated

The Cryptography Handbook is designed to be a quick study guide for a product development engineer, taking an engineering rather than theoretical approach. In this series, we start with a general overview and then define the characteristics of a secure cryptographic system. We then describe various cryptographic concepts and provide an implementation-centric explanation of physically unclonable function (PUF) technology. We hope that this approach will give the busy engineer a quick understanding of the basic concepts of cryptography and provide a relatively fast way to integrate security in his/her design.

Click here to download the whitepaper

Featured Chalk Talk

uPOL Technology

Sponsored by Mouser Electronics and TDK

Power modules are a superior solution for many system designs. Their small form factor, high efficiency, ease of design-in, and solid reliability make them a great solution in a wide range of applications. In this episode of Chalk Talk, Amelia Dalton chats with Tony Ochoa of TDK about the new uPOL family of power modules and how they can deliver the power in your next design.

Click here for more information about TDK FS1406 µPOL™ DC-DC Power Modules