industry news
Subscribe Now

Baum Launches New Version of Power Modeling, Analysis Solutions for Hardware Design

Will Showcase PowerBaum at DAC June 25-27 at Moscone Center in San Francisco

CONCORD, MASS. –– June 12, 2018 –– Baum Inc. today launched the latest version of its flagship product PowerBaum, a state-of-the-art, high-speed and accurate power modeling and analysis solution for engineering groups to fully optimize the energy efficiency of their hardware designs.

PowerBaum 2.0 will be showcased in Booth #2454 at the Design Automation Conference (DAC) June 25-27 at the Moscone Center West in San Francisco. Baum will highlight PowerBaum 2.0’s new capabilities, including links to hardware emulation to analyze and fix power “bugs” in realistic software scenarios.

“The three fundamental requirements of power analysis are power model generation, high-speed analysis, and assurance of implementation accuracy across the entire development phase,” remarks Andy Ladd, chief executive officer and co-founder of Baum. “All three are addressed in PowerBaum 2.0, strengthening Baum’s power modelling to deliver best-in-class power analysis solutions.”

The Latest Version of PowerBaum

PowerBaum generates power models by automatically learning and abstracting power behavior to achieve a high level of accuracy, running orders of magnitude faster than existing solutions in the market.

The new version of PowerBaum targets designs where power and thermal issues are critical, often found in mobile, multi-media, automotive, internet of things (IoT), networking and server applications. It is used earlier in the design cycle when there are more opportunities to uncover and fix power bugs and issues during hardware/software co-design, providing a better methodology to optimize designs for low-power consumption.

Advanced power modeling for hardware emulation is also supported in the new release. “Hardware emulation provides the speed and flexibility to run realistic scenarios on new designs,” remarks Youngsoo Shin, Baum’s chief technology officer. “The efficiency and high speeds of Baum’s power models complement hardware emulation very well and allow engineers to profile power problems under real operating conditions of the design. Combining implementation-accurate Baum power models with hardware emulation create an ideal solution for identifying and analyzing power problems in the design of large systems.”

The automated power analysis and modeling solution supports dynamic and static power, taking in register transfer level (RTL) and netlist descriptions of the design. A new enhancement supports power analysis with arbitrary temperatures specified by designers, thereby providing a methodology to understand temperature effects on their design’s power consumption. PowerBaum models plug into third-party RTL or SystemC simulators and automatically generate time-based power waveforms.

A new companion product called PowerWurzel integrates with PowerBaum 2.0 by efficiently and accurately analyzing gate-level power, adding a higher level of accuracy to Baum’s power models.

PowerBaum 2.0 and PowerWurzel are shipping today and available globally. Pricing is available upon request.

About Baum

Baum provides electronic design automation (EDA) software and solutions that enable engineering groups in the automotive, internet of things (IoT), mobile, networking and server markets to fully optimize the energy efficiency of their semiconductor designs. Founded in 2016 by seasoned semiconductor professionals with technical, R&D and business development expertise, Baum is privately held and funded.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Miniaturization Impact on Automotive Products
Sponsored by Mouser Electronics and Molex
In this episode of Chalk Talk, Amelia Dalton and Kirk Ulery from Molex explore the role that miniaturization plays in automotive design innovation. They examine the transformational trends that are leading to smaller and smaller components in automotive designs and how the right connector can make all the difference in your next automotive design.
Sep 25, 2023
26,212 views