industry news
Subscribe Now

Avnet Extends Embedded Vision Capabilities with Multi-Camera FMC Module

PHOENIX – September 5, 2018 — Avnet (Nasdaq: AVT), a global technology solutions company, today announced the new Multi-Camera FMC Module, an UltraZed-compatible device designed to help engineers more quickly and efficiently develop custom video systems using Xilinx MPSoCs, and in turn, allows customers to immediately start development of their vision applications.

“Avnet recognized early that modern vision applications require a mix of hardware and software to achieve an optimal embedded solution,” said Mario Bergeron, technical marketing engineer, Avnet. “The Avnet Quad-Camera FMC Bundle, together with the Xilinx Zynq-UltraScale+ MPSoC, offers an ideal embedded platform for embedded vision algorithms.”

The Avnet Multi-Camera FMC Module expands the company’s embedded vision support for video analytics, video imaging, surveillance and other vision-guided functionalities, with applications for a range of industries including: automotive, defense and aerospace, embedded processing, and the Internet of Things (IoT).

“The Avnet Multi-Camera FMC module is a critical piece of Xilinx reVISION strategy and comes with complete tools, IP and design support to create an out-of-box experience for users,” said Girish Malipeddi, product manager for video and imaging solutions at Xilinx, a MIPI Alliance contributor. “In working with Avnet to deliver this product, we’ll be able to expand Xilinx’s role in automotive, drones and consumer applications.”

The Multi-Camera FMC Module is available as a standalone component or within the Quad-Camera FMC Bundle, which also includes a cable assembly and four camera modules with GMSL serialization. The Quad Camera FMC Bundle is fully integrated to the Xilinx reVISION stack, which features development resources to help design engineers get their ideas to market faster.

“The Avnet Multi-Camera FMC module will empower our customers to quickly develop high performance imaging solutions for autonomous driving and vision-guided applications,” said John Gerard, director of marketing for the Intelligent Sensing Group at ON Semiconductor. “The integration of the AR0231AT CMOS image sensor into the Multi-Camera FMC Module enables it to achieve over 120dB dynamic range with LED flicker mitigation, allowing the platform to operate in the most challenging lighting conditions.”

Technical Specifications

The Avnet Multi-Camera FMC module supports up to four high-definition camera modules using MAXIM Integrated GMSL (Gigabit Multimedia Serial Link) technology. Features include:

  • Low Pin Count (LPC) FMC Module
  • Quad GMSL Deserializer from MAXIM Integrated (MAX9286)
  • Support for four ON Semiconductor 2.3 MPixel image sensors (AR0231AT)
  • High-Speed FAKRA Mini (HFM) connectors.

The Quad AR0231AT Camera FMC Bundle bundle is designed for Xilinx Zynq-UltraScale+ FMC carriers, including the ZCU102, ZCU104, as well as the Avnet UltraZed EV SOM and Carrier. The bundle features:

  • One AES-FMC-MULTICAM4-G FMC module
  • One Quad-HFM to 4x FAKRA Cable Assembly
  • Four camera modules, each composed of:

o   A MAX96705 Serializer Kit (MARS1-MAX96705-GEVK)

o   A AR0231AT Image Sensor Board (MARS1-AR0231AT7-GEVB)

  • Quick Start Card and downloadable documentation and reference designs.

The Multi-Camera FMC Module is $299; the Quad AR0231AT Camera FMC Bundle is $1699; both with immediate availability, and more information at:http://ultrazed.org/fmc-multi-cam4.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

BMP585: Robust Barometric Pressure Sensor
In this episode of Chalk Talk, Amelia Dalton and Dr. Thomas Block from Bosch Sensortec investigate the benefits of barometric pressure sensors for a variety of electronic designs. They examine how the ultra-low power consumption, excellent accuracy and suitability for use in harsh environments can make Bosch’s BMP585 barometric pressure sensors a great fit for your next design.
Oct 2, 2023
26,222 views