industry news
Subscribe Now

Asterion EV Wire Bonder Enables Steatite to Reduce Time Taken to Make Electrical Interconnects in Custom Battery Packs by up to 50%

Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied and installed a Kulicke & Soffa (K&S) Asterion EV wedge bonder at Steatite’s Power Business Unit. Steatite specialises in the creation of custom battery packs, which often need to be of a particular size and shape, and the company has been designing and manufacturing lithium battery packs, COTS battery modules, and portable power and energy storage systems for more than 30 years.

The Asterion EV gives Steatite the ability to establish electrical connections using wire bonding in up to half the time spot welding would take, in many cases. In addition, wire bonding makes possible the creation of battery packs with high discharge capabilities and improved performance, as a result of the very low resistance of the bond wire.

“Wirebonding complements our other manufacturing capabilities,” comments Dave Carlton, Head of Technical Sales at Steatite’s Power Business Unit, “and the Asterion EV was selected for its large bondable area [300 x 860mm], high resolution [0.1μ] and its ability to perform non-destructive bond wire pull tests whilst bonding. Also, the support from Inseto – from their recommendation of the Asterion EV through to operator training – has been excellent.”

Carlton goes on to say that power failure is not an option in many of the critical applications for which Steatite designs and manufactures battery packs. Steatite battery packs can, for example, be found in products and equipment used in medical, industrial, oceanographic, energy and transport applications.

“With the Asterion EV we have the peace of mind that every cell leaving our factory having been wire bonded is safe, reliable and robust,” concludes Carlton. “This is enabling us to maintain our reputation for battery pack performance quality, a reputation we’ve secured over decades in the power business.”

About Inseto (UK) Limited

Established in 1987 and ISO 9001:2015 Certified since 2005, Inseto is a leading technical distributor of equipment and related materials to the semiconductor, microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive and industrial manufacturing.

The company has three divisions, namely:

  • Equipment Division, which provides manufacturing equipment for the Microelectronic, Photonic, Electronic, Photovoltaic and Semiconductor industries etc.
  • Consumable Division, which provides assembly materials and machine consumable items for the Semiconductor, Electronic, Microelectronic, Photonic MEMS and Hybrid assembly industries etc.
  • Adhesive Division, which provides technically advanced adhesives for bonding, sealing and encapsulation, and which exclusively represents DELO Industrial Adhesives in the UK and Ireland.

Inseto is based in Andover in a high-tech building that houses an adhesives application laboratory, demonstration areas for equipment and instrumentation, and training rooms.

Customer support is at the heart of Inseto’s Total Customer Service philosophy, where the company aims to understand, communicate and fulfil the needs of its customers. The company is committed to meeting customer requirements through the application of high standards of quality and customer care (both before and after sales) by continually investing in training and adopting a policy of continuous improvement.

For further information please visit www.inseto.co.uk

Leave a Reply

featured blogs
Mar 24, 2023
With CadenceCONNECT CFD less than a month away, now is the time to make your travel plans to join us at the Santa Clara Convention Center on 19 April for our biggest CFD event of the year. As a bonus, CadenceCONNECT CFD is co-located with the first day of CadenceLIVE Silicon ...
Mar 23, 2023
Explore AI chip architecture and learn how AI's requirements and applications shape AI optimized hardware design across processors, memory chips, and more. The post Why AI Requires a New Chip Architecture appeared first on New Horizons for Chip Design....
Mar 10, 2023
A proven guide to enable project managers to successfully take over ongoing projects and get the work done!...

featured video

First CXL 2.0 IP Interoperability Demo with Compliance Tests

Sponsored by Synopsys

In this video, Sr. R&D Engineer Rehan Iqbal, will guide you through Synopsys CXL IP passing compliance tests and demonstrating our seamless interoperability with Teladyne LeCroy Z516 Exerciser. This first-of-its-kind interoperability demo is a testament to Synopsys' commitment to delivering reliable IP solutions.

Learn more about Synopsys CXL here

featured chalk talk

Solar Cells Optimized for Indoor Applications
Sponsored by Mouser Electronics and TDK
Solar cell technology is more popular than ever before, but we have only begun to scratch the surface when it comes to new applications for photovoltaic cell technology. In this episode of Chalk Talk, Amelia Dalton chats with Chris Burket from TDK about the basics of photovoltaic cells, what sets TDK’s a-SI film solar cells away from other solar cell technology on the market today and the cool new applications that can take advantage of this powerful technology.
May 26, 2022
37,066 views