industry news
Subscribe Now

ASML announces Holistic Lithography product suite for the 7/5 nanometer node at SEMICON West

SAN FRANCISCO, United States, 10 July 2017 – ASML Holding NV (ASML) today announced lithography, metrology and software innovations at SEMICON West. ASML’s Holistic Lithography integrates a set of products that enables chip makers to develop, optimize and control the production process at the 7/5 nanometer (nm) logic and 16 nm DRAM nodes.

With process nodes continuing to shrink, ASML’s TWINSCAN NXE:3400B EUV lithography system offers the resolution that chip makers need for the most critical layers of a chip, while the new TWINSCAN NXT:2000i DUV immersion system features several hardware innovations, such as redesigned leveling and alignment sensors. This enables DUV/EUV cross-matching on-product overlay of 2.5 nm that addresses a mix-and-match production environment for the most advanced nodes. The lithography systems are complemented by ASML’s new YieldStar 375F metrology system, featuring new optics technology that generates more accurate metrology data faster to support our patterning control loop. Additionally, Hermes Microvision (HMI), which was acquired by ASML last year, expects to ship the new HMI eP5 e-beam metrology system later this year. This system features higher resolution and larger field of view electron optics technology that supports OPC model calibration and pattern fidelity metrology.

“While each product brings independent value to the chip manufacturing process, their true strength lies with working together as part of a well-integrated patterning ecosystem,” said Martin van den Brink, ASML President and Chief Technology Officer. “Our Holistic Lithography products generate fast, accurate and continuous data that chip makers use to drive improved overlay and imaging performance, ultimately enabling the production of affordable semiconductor chips well into single digit process nodes.”

The TWINSCAN NXE:3400B and YieldStar 375F are currently shipping to logic and memory customers worldwide. The HMI eP5 is expected to ship in the second half of this year. The TWINSCAN NXT:2000i has an ongoing early access program that includes key hardware innovations as field upgrades. The first TWINSCAN NXT:2000i that is completely built in our factory is expected to ship in 2018.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Achieving Reliable Wireless IoT
Wireless connectivity is one of the most important aspects of any IoT design. In this episode of Chalk Talk, Amelia Dalton and Brandon Oakes from CEL discuss the best practices for achieving reliable wireless connectivity for IoT. They examine the challenges of IoT wireless connectivity, the factors engineers should keep in mind when choosing a wireless solution, and how you can utilize CEL wireless connectivity technologies in your next design.
Nov 28, 2023
19,898 views