industry news
Subscribe Now

Alliance Memory Expands Low-Power SDRAM Portfolio

Offers LPSDR, LPDDR, and LPDDR2 Devices in Wide Range of Densities and Package Options

SAN CARLOS, Calif. — May 8, 2018 — Alliance Memory, a manufacturer of hard-to-find SRAM, DRAM, and SDRAM ICs, today announced that its SDRAM portfolio now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices.

Alliance Memory’s lineup of high-speed CMOS mobile low-power SDRAMs includes SDR (LPSDR)double data rate (LPDDR), and DDR2 (LPDDR2) devices. Featuring power consumption of 1.8V, the company’s LPSDR SDRAMs are available in densities of 128Mb, 256Mb, and 512Mb in 54-ball and 90-ball FBGA packages. LPDDR devices feature power consumption from 1.7V to 1.95V and densities of 256Mb, 512Mb, 1Gb, and 2Gb in the 60-ball and 90-ball FBGA packages. Enabling ultra-slim designs, LPDDR2 SDRAMs offer power consumption of 1.2V/1.8V and densities of 1Gb, 2Gb, and 4Gb in the 134-ball FBGA package.

For designers of mobile devices tasked with providing more functionality in tighter spaces while using less power, Alliance Memory’s low-power SDRAMs offer a variety of power-saving features, including auto temperature-compensated self-refresh (TCSR) to minimize power consumption at lower ambient temperatures. In addition, their partial-array self-refresh (PASR) feature reduces power by only refreshing critical data, while a deep power down (DPD) mode provides an ultra-low power state when data retention isn’t required.

“With the Internet of Things and proliferation of mobile devices in the consumer, industrial, and medical spaces, we’ve committed ourselves over the past few years to solidifying our offering of low-power ICs,” said David Bagby, Alliance Memory president and CEO. “It began with the introduction of our LPSDR SDRAMs in 2014, followed by our LPDDR devices in 2016, and LPDDR2 SDRAMs in 2017. Now we offer a complete low-power portfolio in a wide range of densities and package options to meet the high demand for these parts.”

Low-power SDRAMs from Alliance Memory include:

Type Part number Density
SDR AS4C8M16MSA-6BIN
AS4C4M32MSA-6BIN
128Mb
AS4C16M16MSA-6BIN
AS4C8M32MSA-6BIN
256Mb
AS4C32M16MSA-6BIN
AS4C16M32MSA-6BIN
512Mb
DDR AS4C16M16MD1-6BCN 256Mb
AS4C32M16MD1A-5BCN
AS4C16M32MD1-5BCNAS4C16M32MD1-5BIN
512Mb
AS4C64M16MD1A-5BIN
AS4C32M32MD1A-5BIN
1Gb
AS4C64M32MD1-5BCN
AS4C64M32MD1-5BIN
2Gb
DDR2 AS4C64M16MD2A-25BIN
AS4C32M32MD2A-25BIN
1Gb
AS4C128M16MD2A-25BIN
AS4C64M32MD2A-25BIN
2Gb
AS4C128M32MD2A-25BIN
AS4C128M32MD2A-18BIN
4Gb

 

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find DRAM and SRAM memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes DRAMs and SRAMs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in San Carlos, California, and regional offices in Europe, Asia, and South America. More information about Alliance Memory is available online atwww.alliancememory.com.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
1,201 views