industry news
Subscribe Now

Advantech launches the new Elkhart Lake Modular Edge Computer UNO-2372G V2

Advantech, a leading global provider of intelligent systems and industrial edge computers, has released UNO-2372G V2 Elkhart Lake Compact Modular Box PC. Advantech’s UNO-2000 series of embedded automation computers are highly rugged, fanless systems. The modular design offers vigorous computing performance and flexible scalability with various I/O ports to support IoT Connectivity. The UNO-2372G V2 features high processing capacity, 4K resolution display ports, optimized I/O port and expansion options to support wire/wireless IoT edge data transmission and processing.

UNO-2372G V2 is a compact, robust, fanless and scalable system with high stability and features Intel® Celeron® J6412 quad-core processor with 8GB DDR4 memory. It can be equipped with an optional second stack for supporting extension iDoor module, including wireless connectivity, industrial fieldbus and more I/O ports. Moreover it supports NVME storage with high data-transmission efficiency.

UNO-2372G V2 is an Industrial Computing Edge device for data acquisition, analytics and nearly instantaneously transmission with a high-throughput network, such as 5G, creating a more comprehensive experience for the user, and enable digital transformation in industrial 4.0 era. It features:

e· Higher Performance CPU: UNO-2372G features a brand new modular design with flexible expansion by adding 2nd expansion module, enhancing the depth and breadth of the industrial application.

  • Versatile Scalability: versatile choices of scalability help customer to have various application. With sensors of temperature, humidity, air quality or light, UNO-2372G V2 can be an excellent remote monitor to help control environment or equipment condition.
  • IoT Edge Gateway: UNO-2372G V2 features high processing capacity, 4K resolution display ports, optimized I/O port and expansion options to support wire/ wireless IOT edge data transmission and processing.

The UNO-2372G compact and robust chassis design can adapt to multiple installation requirements. For more information about UNO-2372G V2, please contact your regional sales team or visit our website

About Advantech

Advantech’s corporate vision is to enable an intelligent planet. The company is a global leader in the fields of IoT intelligent systems and embedded platforms. To embrace the trends of IoT, big data, and artificial intelligence, Advantech promotes IoT hardware and software solutions with the Edge Intelligence WISE-PaaS core to assist business partners and clients in connecting their industrial chains. Advantech is also working with business partners to co-create business ecosystems that accelerate the goal of industrial intelligence.

About CLPA

The CC-Link Partner Association (CLPA) is an open network organization established in 2000 and celebrates its 20th anniversary. The mission of CLPA is to increase the adoption of the CC-Link family of open automation network technologies worldwide. CC-Link is the open fieldbus network standard which originated in Japan, after being developed by industry leaders such as Mitsubishi Electric Corporation. The year 2007 saw the release of CC-Link IE as the first 1Gbps Ethernet-based open industrial network. Subsequently, the year 2018 saw the release of CC-Link IE TSN, a network which significantly improves the performance and functions of the current CC-Link IE. The main activities of the CLPA include the development of the CC-Link family of technical specifications, conducting conformance tests, development support and user support for device selection and application. In addition, the CLPA conducts promotional activities on a global basis in order to achieve wider adoption of the CC-Link family. The CLPA, which began with 134 corporate members, has expanded yearly and, as of the end of January 2023, boasts over 4,000 members, of which 80% are overseas corporations.

About CC-Link IE TSN

CC-Link IE TSN combines the gigabit bandwidth of CC-Link IE with TSN to meet future automation market demands, such as Industry 4.0. This provides flexible integration of Operational Technology (OT) and IT while further strengthening performance and functionality. A comprehensive portfolio of device development options also ensures that any vendor can easily add this technology to their product line-up. The aim is to improve efficiency and reduce time to market for Smart Factories utilizing the IIoT and the products they manufacture. As of January 2023, five years after the announcement of the CC-Link IE TSN specifications, more than 100 models of partner products have been released or are under development.

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 21, 2023
Labforge is a Waterloo, Ontario-based company that designs, builds, and manufactures smart cameras used in industrial automation and defense applications. By bringing artificial intelligence (AI) into their vision systems with Cadence , they can automate tasks that are diffic...
Sep 21, 2023
At Qualcomm AI Research, we are working on applications of generative modelling to embodied AI and robotics, in order to enable more capabilities in robotics....
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....
Sep 21, 2023
See how we're accelerating the multi-die system chip design flow with partner Samsung Foundry, making it easier to meet PPA and time-to-market goals.The post Samsung Foundry and Synopsys Accelerate Multi-Die System Design appeared first on Chip Design....

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit

featured paper

An Automated Method for Adding Resiliency to Mission-Critical SoC Designs

Sponsored by Synopsys

Adding safety measures to SoC designs in the form of radiation-hardened elements or redundancy is essential in making mission-critical applications in the A&D, cloud, automotive, robotics, medical, and IoT industries more resilient against random hardware failures that occur. This paper discusses the automated process of implementing the safety mechanisms/measures (SM) in the design to make them more resilient and analyze their effectiveness from design inception to the final product.

Click here to read more

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023