industry news
Subscribe Now

ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions

Featuring high-performance Intel Atom x7000RE & x7000C series with soldered-down memory and extreme temperature option for industrial-grade stability


ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom processors

  • cExpress-ASL: COM.0 R3.1 Type 6 Compact size module with 2/4/8-core Intel Atom x7000RE & x7000C series, up to 16GB LPDDR5 memory, 8 PCIe Gen3, and 2.5GbE at 6/9/12W TDP
  • LEC-ASL: SMARC 2.1 Short size module with 2/4/8-core Intel Atom x7000RE & x7000C, up to 16GB LPDDR5, 2x 2.5GbE, and 2x MIPI CSI support at 6/9/12W TDP

With soldered-down memory and extreme temperature options, the modules can fulfill various high-performance, low-power, and ruggedized edge solutions running 24/7.

Supporting Intel® TCC, and Time Sensitive Networking (TSN), the modules fit hard-real-time computing workloads required by use cases including industrial automation, AI robots, smart retail, transportation, network communication, etc.

Taipei, Taiwan – April 9, 2024

ADLINK Technology Inc., a global leader in edge computing, announces the release of two new Computer-on-Modules based on the latest Intel® Atom processors, available in two form factors — COM Express (COM.0 R3.1) Type 6 Compact size and SMARC 2.1 Short size — both offering up to 8-core CPU at 6/9/12W TDP. Utilizing Intel’s Gracemont architecture, with broadened cache and memory bandwidth, responsive coding footprint, combined with soldered-down memory and extreme temperature option, the modules deliver superior performance with great efficiency for wide-ranging ruggedized IoT solutions at the edge.

The ADLINK cExpress-ASL module offers a 2/4/8-core Intel Atom x7000RE & x7000C series processor, boosting up to 3.8 GHz, up to 16GB LPDDR5 memory, and is integrated with Intel UHD graphics with up to 32 execution units. Along with support for two digital display interfaces (DisplayPort/HDMI), eight PCIe x1 Gen3 lanes, 2.5GbE LAN, and USB 3.2, it makes your go-to solution for applications including industrial automation, industrial HMI, robotics, AI, and more.

The ADLINK LEC-ASL SMARC module, on the other hand, on top of the 2/4/8-core Intel Atom x7000RE & x7000C series CPU with 4/8/16GB memory, adds support for two CAN bus, and most importantly, two MIPI CSI for camera connection, suiting IoT applications requiring image capturing and on-device graphics processing, such as smart retail, measurement, access control, and transportation.

Both of ADLINK’s two new modules that feature the Intel Atom x7000C series are equipped with Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support. Intel TCC boasts precise time synchronization and CPU/IO timeliness within a system, while TSN optimizes time precision for synchronized networking between multiple systems. Together, the timely execution of deterministic, hard real-time workloads with ultra-low latency is ensured, making them ideal for critical networking gateway and communication use cases.

Built for highly responsive on-device AI execution and at the same time can withstand ruggedized use scenarios, these new ADLINK COMs allow developers to realize various IoT edge innovations moving forward.

ADLINK will also be providing COM Express and SMARC development kits based on the cExpress-ASL and LEC-ASL modules, with carriers supporting all-around comprehensive interfaces for on-the-spot prototyping and referencing.

For more information about ADLINK COMs, follow these links here at cExpress-ASL (COM Express Type 6) and LEC-ASL (SMARC) modules. Stay tuned, as ADLINK is working to offer another COM Express Type 10 module based on Intel Atom X7000RE & X7000C series processors (Amston Lake).

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

One Year of Synopsys Cloud: Adoption, Enhancements and Evolution
Sponsored by Synopsys
The adoption of the cloud in the design automation industry has encouraged innovation across the entire semiconductor lifecycle. In this episode of Chalk Talk, Amelia Dalton chats with Vikram Bhatia from Synopsys about how Synopsys is redefining EDA in the Cloud with the industry’s first complete browser-based EDA-as-a-Service cloud platform. They explore the benefits that this on-demand pay-per use, web-based portal can bring to your next design. 
Jul 11, 2023