Summary:

• High graphics performance up to 12-engine X^e3 architecture, simplifying system integration, especially for graphics-intensive applications
• Advanced hybrid CPU architecture (P/E and LPE cores) combined with 128 GB DDR5, maximizing power-performance efficiency and responsiveness
• For complex edge AI workloads: up to 120 TOPS GPU and up to 50 TOPS NPU
• Additional industrial-temperature SKUs, featuring IBECC memory and TSN Ethernet, are suitable for mission-critical and rugged applications
• Intel^® Core™ Ultra Series 3 in a compact COM-HPC Mini form factor for space-constrained applications, expected in Q2 2026

New Heights in Edge AI: Significantly Faster NPU and GPU Performance

ADLINK Technology Inc., a global leader in edge AI computing solutions, proudly presents its latest Express-PTL COM modules powered by the Intel^® Core™ Ultra Series 3 processors, also known as Panther Lake H-series. Express-PTL modules deliver a major performance leap with their advanced AI architecture, featuring an integrated NPU 5.0 that provides up to 50 TOPS of dedicated AI acceleration, and a next-gen Intel^® X^e3 GPU designed for efficient, streamlined operation, delivering up to 120 TOPS of GPU performance for AI tasks and significant improvement in graphics rendering, supporting up to 16 CPU cores and up to 12 X^e3 engines, tailored not only for heavy but also for complex edge AI workloads.

High-Performance, Rugged Design for Mission-Critical Edge AI

Built on Intel’s most advanced processor, it incorporates a hybrid CPU architecture with 4 high-performance (P) cores, 8 efficiency (E) cores, and 4 low-power (LPE) cores, offering improved processing efficiency and enhanced transistor performance. Complementing this high-performance computing, the module supports up to 128GB of DDR5 SO-DIMM with IBECC for low-latency, reliable memory access. Industrial-temperature SKUs are engineered to withstand extreme rugged environments with a temperature range from –40°C to 85°C. Industrial features such as TCC, TSN, In-Band ECC, extended temperature support, and FuSa/FSEDP compliance further ensure robust, mission-critical operation, making the module a versatile and dependable solution for edge AI and general embedded deployments in demanding conditions.

Versatile AI Solutions for Complex Application Workloads

The Express-PTL module delivers powerful AI performance and efficient system design across a wide range of applications:

The Express-PTL module delivers enhanced graphics performance with its integrated Intel^® Xe³ GPU, featuring a simplified design that reduces complexity and helps lower system costs. It offers enhanced graphics performance while simplifying system design and reducing overall costs, making it ideal for graphics-intensive applications such as medical imaging and infotainment.

For autonomous robots, including humanoids and quadrupeds, the module delivers fast, efficient AI computation for navigation, object recognition, and real-time decision-making. Its improved communication architecture, via a higher bandwidth PCIe interface, enables low-latency accelerator interaction, allowing robots to respond instantly while maintaining high computational efficiency.

The Express-PTL module is engineered for extreme rugged environments, supporting a –40°C to 85°C temperature range for both operating and storage conditions, making it ideal for industrial automation, outdoor systems, and edge deployments exposed to severe temperature fluctuations.

What’s Next? Panther Lake-H Powers ADLINK’s Next Wave of AI

Following the release of the Express-PTL, COM-HPC-mPTL expands the embedded solutions portfolio with compact and high-performance solution designed for space-constrained edge applications. The COM-HPC-mPTL integrates the CPU, NPU, and GPU into a single unit with soldered-down memory, ensuring reliable operation under vibration, shock, and extreme temperatures. Scheduled for release in Q2 2026, the COM-HPC-mPTL will be available in a 95 mm x 70 mm module size (COM-HPC Mini), delivering high-performance computing for compact, rugged AI systems.

ADLINK’s Express-PTL and COM-HPC-mPTL development kits, including reference carriers and full I/O support, will be available in Q2 of 2026 to help you accelerate prototyping and simplify system integration.

For more information about ADLINK Computer-on-Modules, visit adlinktech.com.

For more information about ADLINK I-Pi Development Kits, visit ipi.wiki/ .