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6SigmaET by Future Facilities launches the 16th version of its thermal simulation software for the electronics industry, Release 16.

London, UK, 10 January 2022 – 6SigmaET by Future Facilities launches its latest software version, Release 16, which introduces an array of new and improved features and functionality, including Enhanced View Photorealistic Models, faster Joule Heating, faster PCB Import, optimized 1D Flow Network, and 6SigmaCommander AI Automation.

Release 15 of 6SigmaET emphasized the importance of powerful solving and accuracy to thermal engineers. Release 16 builds on these important functionalities with the addition of streamlined PCB Imports, photorealistic models in reports, powerful simulations — faster model creation, faster grid generation, and faster solve times — accelerating complex model simulations, and improved automation of model builds, edits, solves, and results generation.

6SigmaET Release 16 utilizes the NVIDIA CUDA Toolkit and AmgX library to accelerate the Joule Heating solver. This GPU-acceleration enables solutions times that are 325 times faster on a single NVIDIA A100 Tensor Core GPU compared to a CPU-based run, thereby reducing the solve time for complex models from hours to seconds.

Additionally, the radiative heat transfer calculations now use the Monte-Carlo method with GPU-accelerated ray tracing using the NVIDIA OptiX engine/API. OptiX and CUDA libraries help accelerate and optimize the performance of the ray-tracing algorithm, resulting in a speed-up of 140 times on an A100 GPU when compared to a CPU. The tremendous performance boost achieved with NVIDIA GPUs will enable faster turnaround times for advanced thermal simulations in electronics without having to sacrifice complexity or accuracy when making design related decisions.

Thermal engineers also have more control with significantly faster (25 times faster), streamlined PCB imports and the ability to decide the level of import detail for each PCB layer.

The 1D Flow Network has been optimized to deliver fast and accurate thermal flow analysis of electronic systems and servers. As a result, the junction temperature of components and the heat transfer between liquid-cooled elements can be predicted within a single network.

Additionally, a representation of IT equipment can be modeled as a 1D Flow Network within 6SigmaET and then used in a 6SigmaRoom data center simulation to provide more detailed information on server operating conditions.

Finally, powerful automation functionality in Release 16 using 6SigmaCommander to create or edit models, run the solver and extract results enables optimization and AI interaction.

Commenting on the new release, Tom Gregory, Product Manager at 6SigmaET, said, “Thermal engineers operate in a market that is constantly in flux. With the speed at which electronics and their associated uses are evolving, thermal engineers need to be able to rely on software that can keep pace with the demands of their job and the electronics industry.

“We listened to our customers’ feedback, and I’m delighted with what our team has achieved with 6SigmaET Release 16. With high-quality modeling to powerful simulations, customizable and collaborative reporting, time and cost savings, and fast and accurate performance, 6SigmaET Release 16 empowers thermal engineers and helps organizations in the electronics industry to stay ahead.”

Explore what 6SigmaET Release 16 has to offer here.

About 6SigmaET by Future Facilities

6SigmaET is the leading electronics thermal simulation software with state-of-the-art intelligence, automation, and accuracy. Designed by Future Facilities for thermal engineers in the electronics industry, 6SigmaET uses advanced computational fluid dynamics (CFD) to create accurate models of electronic equipment that allow engineers to test their designs through thermal simulations and mitigate any and all risks.

Thermal simulation is a key element of the engineering design process. Our software enables your team to create and solve models quickly, verify electronic designs before manufacturing, and optimize the best thermal performance while reducing time to market. This level of intelligence and automation enables designers to spend more time on design, and less time on software operations.

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