industry news
Subscribe Now

30V MOSFET from Diodes Incorporated Enables Rapid and Safe Discharge of Bulk Capacitors on FPGA Power Rails

Plano, Texas – October 6th, 2015 – The DMN3027LFG 30V N-channel MOSFET introduced by Diodes Incorporated is designed as a switch to rapidly and safely discharge large bulk capacitors used on FPGA power rails. The latest FPGAs found in telecoms equipment, servers and data centers have multiple power rails that need to be correctly sequenced to safely power these systems up and down. Designers of high-reliability DC-DC power supplies can achieve this quickly and easily with this new MOSFET from Diodes.

The DMN3027LFG has an RDS(on) of 26m? at 4.5V, which is low enough to discharge a 15mF capacitor in <10ms but not so low that sharply rising current peaks could cause EMI issues or give rise to transient thermal stresses, potentially damaging the MOSFET or capacitor bank. Under the typical FPGA low-voltage rail conditions of 1V, this current is self-limited by the MOSFET channel resistance as specified in the safe operating area (SOA). This SOA is given at a +60°C ambient temperature with minimal heat-sinking to support the typical application conditions, allowing peak currents up to 20A to be safely handled in <10ms.

The DMN3027LFG is offered in a PowerDI®3333 package, which has a low thermal resistance from junction to exposed pad of <10°C/W enabling the dissipation of up to 3W. It is priced at $0.25 each in 10k quantities. Further information is available from http://www.diodes.com

About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes’ products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes’ corporate headquarters and Americas’ sales office are located in Plano, Texas. Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany. Diodes’ wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with two additional facilities located in Shanghai, China.  Diodes has assembly and test facilities located in Shanghai and in Chengdu, China, as well as in Neuhaus and Taipei. Additional engineering, sales, warehouse, and logistics offices are located in Taipei; Hong Kong; Manchester; Shanghai; Shenzhen, China; Seongnam-si, South Korea; and Munich, Germany, with support offices throughout the world. For further information, including SEC filings, visit Diodes’ website at http://www.diodes.com.

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
24,898 views