industry news
Subscribe Now

EMVCo approves Micropross EMVCo L1 contactless PICC analog test tool according to the new version of the test specification

Micropross announced today the reception of the EMVCo issued approval letter, stating that EMVCo had successfully qualified Micropross’EMVCo Contactless L1 PICC and mobile analog test tool according to the brand new 2.5 test specification.

This means, EMVCo authorized test laboratories can now start to deploy this new version in order to perform debug and type approval sessions starting from November 2015 to their customers.

Philippe Bacle, President and CEO of Micropross commented : “Once again, Micropross is in a position to supply the new version of the EMVCo Contactless L1 PICC and Mobile analog test tool right on time, to follow the needs of the network of EMVCo approved test laboratories which made the choice to use the Micropross test solutions. At Micropross we highly value the relationship we have with all laboratories which use our test solution. We strive to supply them with reliable and  efficient test equipment, as we consider our job and duty is to make those customers successful.”

Another proof in the deep commitment of Micropross to ease the life of their customers, is that Micropross made the choice to perform the validation of the EMVCo Contactless L1 PICC and Mobile analog test tool on both the MP300 TCL2, and the MP500 TCL3.

The Micropross EMVCo L1 contactless PICC analog test tool is part of Micropross Contactless Test Station test platform. The Contactless Test Station can be summarized like this : 1 provider, 1 platform, and more than 20 different test suites that can run on top of this platform. The coverage of Micropross in areas such as EMVCo L1, NFC Forum, ISO 10373-6:2015 is total, not to mention the possibility to perform Wireless Charging oriented testing.

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

GaN for Humanoid Robots
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Eric Persson and Amelia Dalton explore why power is the key driver for efficient and reliable robot movements and how GaN technologies can help motor control solutions be more compact, integrated and efficient. They also investigate the role of field-oriented control in humanoid robotic applications and why the choice of a GaN power transistor can make all the difference in your next humanoid robot project!
Apr 20, 2026
3,755 views