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Diodes Incorporated Enables Cost-Effective Headset Detection with Low Power IC in Miniature Package

Plano, Texas – September 16, 2015 – The AZV5001 headset detection IC introduced by Diodes Incorporated is targeted at cost- and power-sensitive consumer electronics such as mobile phones, tablet computers and media players. The integration of a comparator, OR gate and N channel MOSFET into a miniature package enables the connection of a headset with microphone to be quickly and simply detected.

The AZV5001 has two detect inputs that together determine when a headset has been inserted into the equipment’s audio jack. The presence of a left audio signal drives the internal comparator output low, which when logically OR’ed with a ground connection from the jack will result in a low output from the IC, indicating the headset is properly connected. Internal pull up resistors on both detect inputs ensure that connection is not indicated when either signal is absent. When a headphone is not detected, an on-chip N-channel MOSFET is enabled, which can be used to mute the microphone input to the equipment’s audio codec.

A miniature 6-pin 1.2mm x 1.0mm x 0.4mm DFN1210H4-6 package helps the AZV5001 reduce board space. A low supply current, typically 7.5?A when operating from a 1.8V supply, reduces system power consumption while low voltage operation, down to 1.6V, is also supported.

In 1k piece quantities, the AZV5001 in the DFN1210H4-6 package is priced at $0.13 each. Further information is available at www.diodes.com

About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes’ products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes’ corporate headquarters and Americas’ sales office are located in Plano, Texas. Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany. Diodes’ wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with two additional facilities located in Shanghai, China.  Diodes has assembly and test facilities located in Shanghai and in Chengdu, China, as well as in Neuhaus and Taipei. Additional engineering, sales, warehouse, and logistics offices are located in  Taipei; Hong Kong; Manchester; Shanghai; Shenzhen, China; Seongnam-si, South Korea;  and Munich, Germany, with support offices throughout the world. For further information, including SEC filings, visit Diodes’ website at http://www.diodes.com.

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