industry news
Subscribe Now

Connect One Introduces New Broadcom-enabled IoT and M2M Wi-Fi Modules

far Saba, Israel, February 9, 2015— Connect One™, the Device Networking Authority™, today announced a collaboration with Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, to enable Connect One’s G2 Wi-Fi modules for the M2M and Internet of Things (IoT) market.

The combination of Broadcom’s WICED Wi-Fi system-on-chip, together with Connect One’s iChip™ Internet Controller, offers vast functionality and ease-of-integration to many applications in areas such as home automation, medical, security, industrial control, smart grid, asset management, and point of sale.

Building on its Internet protocols, security, management, and simple API, Connect One’s G2 product line enables product manufacturers to connect, secure, and manage IoT products over the Internet in just a couple of hours.

The G2 modules feature Broadcom’s BCM43362 Wi-Fi system-on-chip (SoC), 802.11b/g/n MAC and baseband functionality, offering excellent system performance for IoT connectivity.

The G2 modules build on this foundation with Connect One’s iChip Internet Controller. The resulting solution provides multiple hardware interfaces, extensive firmware, and a full suite of secure Internet protocols for Wi-Fi client mode and up to eight Wi-Fi users in router or access-point modes. Designers gain immediate, full-featured connectivity without any Wi-Fi driver development or porting, thereby minimizing project development challenges and time-to-market.

“Broadcom has established its leadership and technology expertise in wireless IoT solutions over the years,” confirmed Erez Lev, General Manager for Connect One. “Through our collaboration, we can deliver the high performance and functionality our customers require at a low cost. Our customers can be confident of excellent support and our joint commitment to the future.”

“Through our collaboration with Connect One, we’re providing an easy-to-use platform for OEMs and start-ups alike to quickly design, produce and go to market with affordable, connected products,” said Sid Shaw, Broadcom Senior Product Line Manager, Wireless Connectivity. “Manufacturers and integrators worldwide will benefit from simple integration, and a cost-effective, complete Wi-Fi solution.”

The G2 product line includes many features and interfaces required for M2M and IoT product designs, and special stand-alone modes of operation such as routing, access point, and Ethernet-to-Wi-Fi bridge. The G2 Wi-Fi modules are available now.

Connect One’s G2 Wi-Fi modules will be on display at Embedded World 2015 in Nuremberg, Germany, February?24-26 in?Hall 5, Stand 251.

For more information, visit Connect One at www.connectone.com, or the Broadcom partner page at http://community.broadcom.com/community/partners/connect-one/overview.

About Connect One

Established in 1996, Connect One Ltd. is widely regarded as the device networking authority, with many innovative firsts to its credit. The company manufactures semiconductors, modules, and device servers that facilitate secure, reliable, and robust Internet protocol-based communication for everyday devices. Connect One is privately owned, with offices in Kfar Saba, Israel.

For further information, please visit the company’s Web site at www.connectone.com or e-mail info@connectone.com.

 

Leave a Reply

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
28,659 views