industry news
Subscribe Now

GUC and Credo Collaborate to Enable 16-nm FinFET+ Chip Development

Hsinchu, Taiwan and Milpitas, Calif., January 6th, 2015 – Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM, and Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced they are collaborating to enable the development of high-performance networking solutions that will be manufactured using TSMC’s 16-nm FinFET+ process technology.  Leveraging GUC’s back-end design service expertise, the companies are working together to integrate Credo’s 28G and 56G SerDes IP and have already taped out a solution based on TSMC’s 16-nm FF+ process technology. 

            “Our collaboration with Credo is an extremely unique approach to solving some of the complex problems associated with designing high-performance devices at advanced technology nodes,” said Jim Lai, president of GUC. “We believe this is a model that will set a new standard for the entire semiconductor industry.”

By working together at such an advanced node, the companies expect to significantly improve chip integration, shorten the design cycle and reduce power consumption in networking chips that are the backbone of switches, routers and other network hardware. 

“We have worked closely with GUC to ensure the seamless integration of our 28G and 56G IP with their 16nmFF+ SOC integration platform,” said Bill Brennan, president and CEO of Credo.  “We believe our collaboration will lead to first-pass silicon success for our customers and accelerate the adoption of 16FF+ ASICs for the 100G and 400G enterprise networking and data center markets.” 

Networking devices have traditionally relied on wide channel counts to achieve the required bandwidth and system throughput due to the lack of availability of lower power, high performance SerDes at advanced processing nodes.  As one of the first companies to deliver a 56G SerDes IP solution, Credo offers technology that will significantly reduce the number of channels, chip area, and power consumption. The approach eliminates bottlenecks that can occur when multiple channels are used to increase the throughput and bandwidth of networking chips and systems. 

About Credo

Credo Semiconductor is a provider of high performance mixed-signal integrated circuits and IP targeting the data center and enterprise networking markets.  The company’s SerDes technologies enable optimized solutions for leading edge speed, power, and signal processing requirements. For more information: www.credosemi.com

About GUC

GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services. Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, visit www.guc-asic.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Autonomous Robotics Connectivity Solutions
Sponsored by Mouser Electronics and Samtec
Connectivity solutions for autonomous robotic applications need to include a variety of orientations, stack heights, and contact systems. In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec explore trends in autonomous robotic connectivity solutions and the benefits that Samtec interconnect solutions bring to these applications.
Jan 22, 2024
13,647 views